MPC5125YVN400 Freescale Semiconductor, MPC5125YVN400 Datasheet - Page 902

IC MCU 32BIT E300 324TEPBGA

MPC5125YVN400

Manufacturer Part Number
MPC5125YVN400
Description
IC MCU 32BIT E300 324TEPBGA
Manufacturer
Freescale Semiconductor
Series
MPC51xxr

Specifications of MPC5125YVN400

Core Processor
e300
Core Size
32-Bit
Speed
400MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, USB OTG
Peripherals
DMA, WDT
Number Of I /o
64
Program Memory Type
ROMless
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
1.33 V ~ 1.47 V
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
324-PBGA
Processor Series
MPC51xx
Core
e300
Data Bus Width
32 bit
Development Tools By Supplier
TWR-MPC5125-KIT, TWR-SER, TWR-ELEV, TOWER
Maximum Clock Frequency
400 MHz
Operating Supply Voltage
1.4 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Data Ram Size
32 KB
I/o Voltage
3.3 V
Interface Type
CAN, I2C
Minimum Operating Temperature
- 40 C
Program Memory Size
32 bit
Cpu Speed
400MHz
Embedded Interface Type
CAN, I2C, SPI, UART, USB
Digital Ic Case Style
TEPBGA
No. Of Pins
324
Rohs Compliant
Yes
Cpu Family
MPC5xx
Device Core Size
32b
Frequency (max)
400MHz
Total Internal Ram Size
32KB
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
324
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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Universal Serial Bus Interface with On-The-Go
32.5.6.2
The second and third doublewords of a queue head specify static information about the endpoint. This
information does not change over the lifetime of the endpoint. There are three types of information in this
region:
The host controller must not modify the bits in this region.
32-74
Packet Length
Maximum
31:28
26:16
Field
Field
Typ
2:1
RL
27
15
C
H
0
T
Endpoint Characteristics. These are the USB endpoint characteristics including addressing,
maximum packet size, and endpoint speed.
Endpoint Capabilities. These are adjustable parameters of the endpoint. They affect how the
endpoint data stream is managed by the host controller.
Split Transaction Characteristics. This data structure manages full- and low-speed data streams for
bulk, control, and interrupt via split transactions to USB2.0 hub transaction translator. There are
additional fields for addressing the hub and scheduling the protocol transactions (for periodic).
Endpoint Capabilities/Characteristics
This field indicates to the hardware whether the item referenced by the link pointer is an iTD, siTD or a QH. This
allows the host controller to perform the proper type of processing on the item after it is fetched.
00 iTD (isochronous transfer descriptor)
01 QH (queue head)
10 siTD (split transaction isochronous transfer descriptor)
11 FSTN (frame span traversal node)
Terminate.
1 Last QH (pointer is invalid).
0 Pointer is valid.
If the queue head is in the context of the periodic list, a one bit in this field indicates to the host controller that
this is the end of the periodic list. The host controller ignores this bit when the queue head is in the
asynchronous schedule. Software must ensure that queue heads reachable by the host controller always have
valid horizontal link pointers.
Nak Count Reload. This field contains a value used by the host controller to reload the Nak counter field.
Control Endpoint Flag. If the QH[EPS] field indicates the endpoint is not a high-speed device and the endpoint
is a control endpoint, software must set this bit to a one. Otherwise, it should always set this bit to a zero.
This directly corresponds to the maximum packet size of the associated endpoint (wMaxPacketSize). The
maximum value this field may contain is 0x400 (1024).
Head of reclamation list flag. This bit is set by system software to mark a queue head as being the head of the
reclamation list.
Table 32-62. Endpoint Characteristics: Queue Head doubleword 1
Table 32-61. Queue Head doubleword 0 (continued)
MPC5125 Microcontroller Reference Manual, Rev. 2
Description
Description
Freescale Semiconductor

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