MPC5125YVN400 Freescale Semiconductor, MPC5125YVN400 Datasheet - Page 637

• Manufacturer Part Number: MPC5125YVN400
• Description: IC MCU 32BIT E300 324TEPBGA
• Manufacturer: Freescale Semiconductor
• Series: MPC51xxr

Specifications of MPC5125YVN400

• Core Processor: e300
• Core Size: 32-Bit
• Speed: 400MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, USB OTG
• Peripherals: DMA, WDT
• Number Of I /o: 64
• Program Memory Type: ROMless
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 1.33 V ~ 1.47 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 324-PBGA
• Processor Series: MPC51xx
• Core: e300
• Data Bus Width: 32 bit
• Development Tools By Supplier: TWR-MPC5125-KIT, TWR-SER, TWR-ELEV, TOWER
• Maximum Clock Frequency: 400 MHz
• Operating Supply Voltage: 1.4 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Data Ram Size: 32 KB
• I/o Voltage: 3.3 V
• Interface Type: CAN, I2C
• Minimum Operating Temperature: - 40 C
• Program Memory Size: 32 bit
• Cpu Speed: 400MHz
• Embedded Interface Type: CAN, I2C, SPI, UART, USB
• Digital Ic Case Style: TEPBGA
• No. Of Pins: 324
• Rohs Compliant: Yes
• Cpu Family: MPC5xx
• Device Core Size: 32b
• Frequency (max): 400MHz
• Total Internal Ram Size: 32KB
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 324
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Freescale Semiconductor
FLASH_CONFIG
CACHE_SWAP
SECTOR_SIZE
DMA_CONFIG
IRQ_STATUS
DMA2_ADDR
(0x3F28)
(0x3F30)
(0x3F30)
(0x3F38)
(0x3F34)
(0x3F24)
Name
W
W
W
W
W
W
W
W
W
W
W
W
R
R
R
R
R
R
R
R
R
R
R
R
STOP
_ON_
WER
R_IR
WER
16
Q
R
0
DMA2_CNT
ID_COUNT
DONE
CMD_
_IRQ
17
1
_IRQ
Table 23-3. NFC Register Summary (continued)
IDLE
MPC5125 Microcontroller Reference Manual, Rev. 2
18
2
19
3
ECC_SRAM_ADDR
R_ST
ATUS
CMD_TIMEOUT
WER
20
4
H_CM
D_BU
DMA1_CNT
FLAS
21
SY
5
BUSY
DUE_
RESI
22
6
BUSY
ECC_
DMA2_ADDR
23
7
DMA2_OFFSET
CACHE_SWAP_ADDR2
CACHE_SWAP_ADDR1
DMA_
BUSY
BIT
16
24
8
SECTOR_SIZE
WERR
_MOD
BOOT
_EN
25
9
E
SRAM
_REQ
ADDR
CMD_
DONE
ECC_
_AUT
O_IN
RESIDUE_B
_EN
CR
10
26
UFF_NO
O_AUT
O_INC
IDLE
DMA_
BUFN
_EN
REQ
11
27
R
NAND Flash Controller (NFC)
ECC_BUFF_
R_CL
WER
EAR
12
28
ECC_MODE
NO
DONE
CMD_
DMA2_CNT
_CLE
PAGE_CNT
AR
13
29
DMA1
_ACT
IDLE_
CLEA
DMA_BUFF_
14
30
R
NO
FLASH
DMA2
_CNT
FAST_
15
31
23-7