MPC5125YVN400 Freescale Semiconductor, MPC5125YVN400 Datasheet - Page 296

IC MCU 32BIT E300 324TEPBGA

MPC5125YVN400

Manufacturer Part Number
MPC5125YVN400
Description
IC MCU 32BIT E300 324TEPBGA
Manufacturer
Freescale Semiconductor
Series
MPC51xxr

Specifications of MPC5125YVN400

Core Processor
e300
Core Size
32-Bit
Speed
400MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, USB OTG
Peripherals
DMA, WDT
Number Of I /o
64
Program Memory Type
ROMless
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
1.33 V ~ 1.47 V
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
324-PBGA
Processor Series
MPC51xx
Core
e300
Data Bus Width
32 bit
Development Tools By Supplier
TWR-MPC5125-KIT, TWR-SER, TWR-ELEV, TOWER
Maximum Clock Frequency
400 MHz
Operating Supply Voltage
1.4 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Data Ram Size
32 KB
I/o Voltage
3.3 V
Interface Type
CAN, I2C
Minimum Operating Temperature
- 40 C
Program Memory Size
32 bit
Cpu Speed
400MHz
Embedded Interface Type
CAN, I2C, SPI, UART, USB
Digital Ic Case Style
TEPBGA
No. Of Pins
324
Rohs Compliant
Yes
Cpu Family
MPC5xx
Device Core Size
32b
Frequency (max)
400MHz
Total Internal Ram Size
32KB
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
324
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MPC5125YVN400
Manufacturer:
Freescale Semiconductor
Quantity:
135
Part Number:
MPC5125YVN400
Manufacturer:
LTC
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Part Number:
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Manufacturer:
Freescale Semiconductor
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Display Interface Unit (DIU)
10.4.3
The DIU has been designed for maximum flexibility in the format of its input data. Each pixel can contain
as many as four basic components: alpha, red, green, and blue. The contents of several registers in an area
descriptor (see
The first step is to define the size of each pixel (PIXEL_S+1) and the number of bits for each component
of a pixel (COMP_0 to COMP_3) in the data stream. The next step is to assign the components of the pixel
(alpha, R, G, and B) to the components of the data stream (COMP_0 to COMP_3). The RED_C,
GREEN_C, BLUE_C, and ALPHA_C fields in the pixel format (word 0) of the AD are used to control the
assignments, selecting which component is red, which is green, and so on. The three color components
(red, green, and blue) must be mapped to one of the components of the data stream; alpha can be assigned
to a fourth component of the data stream or the pixel can use the global alpha value specified for the current
area descriptor (G_ALPHA in word 2).
The pixel format (word 0) of the AD also contains the BYTE_F bit, which can have a significant impact
on the way the DIU interprets the pixel data. If the BYTE_F bit in the AD is set (that is, flipping is disabled)
then the pixel is constructed as shown in
If the BYTE_F bit in the AD is cleared (that is, bytes in the pixel are flipped) then the pixel is constructed
as shown in
mapping.
10-34
Reset
Reset
COMP_3
COMP_2
COMP_1
COMP_0
W
W
Field
R
R
Figure 10-43. Example of 24-bit ARGB 8:5:6:5 Pixel Structure Definition when BYTE_F = 1
Table 10-38. Example of 24-bit ARGB 8:5:6:5 Pixel Structure Definition when BYTE_F = 1
16
0
0
0
Pixel Structure
Figure
COMP_1
Figure
17
0
0
1
Alpha (8 bits).
Red (5 bits).
Green (6 bits).
Blue (5 bits).
10-44. The DIU performs the byte flipping on each pixel before it performs the
10-34) determine how the DIU parses the bitmap data into the pixel components.
18
0
0
2
COMP_3
19
0
0
3
MPC5125 Microcontroller Reference Manual, Rev. 2
20
4
0
0
COMP_0
21
Figure
0
0
5
22
0
0
6
10-43.
23
0
0
7
Description
24
8
0
0
0
25
9
0
0
0
COMP_2
10
26
0
0
0
11
27
0
0
0
12
28
0
0
0
Freescale Semiconductor
Access: User read-only
13
29
0
0
0
COMP_1
14
30
0
0
0
15
31
0
0
0

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