MPC5125YVN400 Freescale Semiconductor, MPC5125YVN400 Datasheet - Page 542

IC MCU 32BIT E300 324TEPBGA

MPC5125YVN400

Manufacturer Part Number
MPC5125YVN400
Description
IC MCU 32BIT E300 324TEPBGA
Manufacturer
Freescale Semiconductor
Series
MPC51xxr

Specifications of MPC5125YVN400

Core Processor
e300
Core Size
32-Bit
Speed
400MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, USB OTG
Peripherals
DMA, WDT
Number Of I /o
64
Program Memory Type
ROMless
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
1.33 V ~ 1.47 V
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
324-PBGA
Processor Series
MPC51xx
Core
e300
Data Bus Width
32 bit
Development Tools By Supplier
TWR-MPC5125-KIT, TWR-SER, TWR-ELEV, TOWER
Maximum Clock Frequency
400 MHz
Operating Supply Voltage
1.4 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Data Ram Size
32 KB
I/o Voltage
3.3 V
Interface Type
CAN, I2C
Minimum Operating Temperature
- 40 C
Program Memory Size
32 bit
Cpu Speed
400MHz
Embedded Interface Type
CAN, I2C, SPI, UART, USB
Digital Ic Case Style
TEPBGA
No. Of Pins
324
Rohs Compliant
Yes
Cpu Family
MPC5xx
Device Core Size
32b
Frequency (max)
400MHz
Total Internal Ram Size
32KB
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
324
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MPC5125YVN400
Manufacturer:
Freescale Semiconductor
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135
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MPC5125YVN400
Manufacturer:
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LocalPlus Bus Controller (LPC)
21-2
Interface to memory mapped or chip selected devices
Two main modes of operation:
— Non-muxed modes
— Muxed modes (address latch enable (ALE) used)
8 chip-select (CS) signals
— Programmable wait states per CS
— Programmable deadcycles per CS
— Programmable holdcycles per CS
— Programmable byte swapping per CS
Configurable boot interface supporting Power Architecture architecture code execution
Dynamic bus sizing
Support of burst mode flash devices (up to 32 byte bursts)
— Synchronous burst read
— Synchronous burst write
— Asynchronous burst read (page mode)
— Asynchronous burst write (page mode)
DMA support allows data movement independently from the CPU (up to 56 byte bursts)
No support of misaligned accesses. This also includes transfers of 3, 5, 6, and 7 bytes.
LPC_CLK
TSIZ[1:0]
AD[31:0]
AX[31:0]
– Address up to 32 bits, data 8, 16, or 32 bits
– Address up to 32 bits, data 8, 16, or 32 bits
– Programmable ALE level
CS[7:0]
Name
ACK
R/W
OE
TS
Address and data lines
Non-muxed mode: address lines
Muxed mode: address latch enable (AX[0])
Transfer size (AX[2:1])
Transfer start (AX[3])
No burst transaction: Acknowledge can shorten a transaction
Burst transaction: Indicates that a burst transaction is ongoing.
LPC clock
Chip select
Output enable
Read/write bar
Transfer size
Transfer start
MPC5125 Microcontroller Reference Manual, Rev. 2
Table 21-1. Signal Properties
Function
I/O Reset
I/O
I/O
O
O
O
O
O
O
O
Freescale Semiconductor
0
0
1
1
1
0
0
Pullup
Pullup

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