MPC5125YVN400 Freescale Semiconductor, MPC5125YVN400 Datasheet - Page 200

IC MCU 32BIT E300 324TEPBGA

MPC5125YVN400

Manufacturer Part Number
MPC5125YVN400
Description
IC MCU 32BIT E300 324TEPBGA
Manufacturer
Freescale Semiconductor
Series
MPC51xxr

Specifications of MPC5125YVN400

Core Processor
e300
Core Size
32-Bit
Speed
400MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, USB OTG
Peripherals
DMA, WDT
Number Of I /o
64
Program Memory Type
ROMless
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
1.33 V ~ 1.47 V
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
324-PBGA
Processor Series
MPC51xx
Core
e300
Data Bus Width
32 bit
Development Tools By Supplier
TWR-MPC5125-KIT, TWR-SER, TWR-ELEV, TOWER
Maximum Clock Frequency
400 MHz
Operating Supply Voltage
1.4 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Data Ram Size
32 KB
I/o Voltage
3.3 V
Interface Type
CAN, I2C
Minimum Operating Temperature
- 40 C
Program Memory Size
32 bit
Cpu Speed
400MHz
Embedded Interface Type
CAN, I2C, SPI, UART, USB
Digital Ic Case Style
TEPBGA
No. Of Pins
324
Rohs Compliant
Yes
Cpu Family
MPC5xx
Device Core Size
32b
Frequency (max)
400MHz
Total Internal Ram Size
32KB
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
324
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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Quantity
Price
Part Number:
MPC5125YVN400
Manufacturer:
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CPU e300 Core Power Architecture
Bursting is supported on the Coherent Systems Bus (CSB). Critical word first protocol is employed when
the e300c4 core attempts to fill its address and data caches. The ID values for the MPC5125 are shown in
Table
7.3
A complete specification for the e300c4 core implementation used on the module is obtained through a
collection of documentation.
The programming environments manual provides information about resources defined by the Power
Architecture architecture common to Power Architecture processors. Implementation variances relative to
Rev. 4 of the Programming Environments Manual are available in the e300 Core Reference Manual.
The e300 Power Architecture Core Family Reference Manual can be obtained from the Freescale
Literature Distribution center at http://www.freescale.com.
7.4
7.4.1
Two Power Architecture instructions are not supported by the module. These two instructions are eciwx
and ecowx. The execution of both instructions generates a TEA signal on the CSB. This causes a machine
check exception or a checkstop.
7.4.2
Enabling of the address or data parity error check by setting the HID0[EBA, EBD] bits generates a
machine check exception or a checkstop depending on the HID0[EMCP] bit.
7-2
7-1.
Power Architecture Microprocessor Family: The Programming Environments for 32-bit
Microprocessors, Rev. 2: MPCFPE32B/AD
e300 Power Architecture Core Family Reference Manual, Rev. 4
e300c4 Core Reference Manual
Unsupported e300c4 Core Features
Instructions
CSB Parity
MPC5125 Microcontroller Reference Manual, Rev. 2
Table 7-1. ID Values for the MPC5125
MPC5125 SVR
JTAG ID Code
PVR
M01S Mask Set
0x0540_C01D
0x8086_2010
0x8019_0010
Freescale Semiconductor

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