MPC5125YVN400 Freescale Semiconductor, MPC5125YVN400 Datasheet - Page 18

IC MCU 32BIT E300 324TEPBGA

MPC5125YVN400

Manufacturer Part Number
MPC5125YVN400
Description
IC MCU 32BIT E300 324TEPBGA
Manufacturer
Freescale Semiconductor
Series
MPC51xxr

Specifications of MPC5125YVN400

Core Processor
e300
Core Size
32-Bit
Speed
400MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, USB OTG
Peripherals
DMA, WDT
Number Of I /o
64
Program Memory Type
ROMless
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
1.33 V ~ 1.47 V
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
324-PBGA
Processor Series
MPC51xx
Core
e300
Data Bus Width
32 bit
Development Tools By Supplier
TWR-MPC5125-KIT, TWR-SER, TWR-ELEV, TOWER
Maximum Clock Frequency
400 MHz
Operating Supply Voltage
1.4 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Data Ram Size
32 KB
I/o Voltage
3.3 V
Interface Type
CAN, I2C
Minimum Operating Temperature
- 40 C
Program Memory Size
32 bit
Cpu Speed
400MHz
Embedded Interface Type
CAN, I2C, SPI, UART, USB
Digital Ic Case Style
TEPBGA
No. Of Pins
324
Rohs Compliant
Yes
Cpu Family
MPC5xx
Device Core Size
32b
Frequency (max)
400MHz
Total Internal Ram Size
32KB
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
324
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MPC5125YVN400
Manufacturer:
Freescale Semiconductor
Quantity:
135
Part Number:
MPC5125YVN400
Manufacturer:
LTC
Quantity:
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Part Number:
MPC5125YVN400
Manufacturer:
Freescale Semiconductor
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10 000
xviii
Chapter 9, “Direct Memory Access (DMA),”
MPC5125.
Chapter 10, “Display Interface Unit (DIU),”
implemented on the MPC5125.
Chapter 11, “DRAM Controller,”
Mobile-DDR, DDR-1, DDR-2, and SDR memories.
Chapter 12, “Multi-port DRAM Controller Priority Manager,”
the DRAM controller.
Chapter 13, “External Memory Bus (EMB),”
External Memory Bus.
Chapter 14, “Fast Ethernet Controller (FEC),”
programming model of the FEC block.
Chapter 15, “General Purpose Timers (GPT),”
perform general purpose timer and general purpose I/O (GPIO) functions.
Chapter 16, “General Purpose I/O (GPIO),”
pin descriptions, register settings and interrupt capabilities.
Chapter 17, “IIM/Fusebox,”
programming information stored in on-chip fuse elements.
Chapter 18, “Integrated Programmable Interrupt Controller (IPIC),”
hardware interrupts for the MPC5125 device.
Chapter 19, “Inter-Integrated Circuit (I2C),”
clock synchronization, and I
Chapter 20, “I/O Control,”
the pads.
Chapter 21, “LocalPlus Bus Controller (LPC),”
MPC5125.
Chapter 22, “MSCAN,”
CAN protocol according to Bosch Specification version 2.0B.
Chapter 23, “NAND Flash Controller (NFC),”
memory devices.
Chapter 24, “Power Management Control Module (PMC),”
provide voltage control for the internal logic of the device.
Chapter 25, “Programmable Serial Controller (PSC),”
modes.
Chapter 26, “PSC Centralized FIFO Controller (FIFOC),”
controller for the PSC modules.
Chapter 27, “Real Time Clock (RTC),”
Chapter 28, “Secure Digital Host Controller (SDHC),”
Multimedia Cards (MMC), Secure Digital (SD) memory cards, and I/O cards.
Chapter 29, “Software Watchdog Timer (WDT),”
software errors by periodically issuing a reset unless interrupted by software.
MPC5125 Microcontroller Reference Manual, Rev. 2
describes the CAN module, a communication controller implementing the
describes the controls for the functional muxing and configuration of
2
describes the module that provides an interface for reading and
C programming model registers.
describes the multi-port DRAM controller that supports
describes the real time clock.
describes the general purpose I/O module, including
describes the Display Interface Unit (DIU)
describes the I
describes how the LPC and the NFC share the
describes the DMA controller implemented on the
describes the feature set, operation, and
describes eight independent timer channels that
describes the interface to standard NAND flash
describes the external bus interface of the
describes the counter that guards against
describes the UART, AC97, Codec, and I
describes the module that interfaces to
describes the centralized FIFO
2
describes the power blocks that
C module, including I
describes the priority manager for
summarizes the software and
Freescale Semiconductor
2
C protocol,
2
S

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