MPC5125YVN400 Freescale Semiconductor, MPC5125YVN400 Datasheet - Page 19

• Manufacturer Part Number: MPC5125YVN400
• Description: IC MCU 32BIT E300 324TEPBGA
• Manufacturer: Freescale Semiconductor
• Series: MPC51xxr

Specifications of MPC5125YVN400

• Core Processor: e300
• Core Size: 32-Bit
• Speed: 400MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, USB OTG
• Peripherals: DMA, WDT
• Number Of I /o: 64
• Program Memory Type: ROMless
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 1.33 V ~ 1.47 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 324-PBGA
• Processor Series: MPC51xx
• Core: e300
• Data Bus Width: 32 bit
• Development Tools By Supplier: TWR-MPC5125-KIT, TWR-SER, TWR-ELEV, TOWER
• Maximum Clock Frequency: 400 MHz
• Operating Supply Voltage: 1.4 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Data Ram Size: 32 KB
• I/o Voltage: 3.3 V
• Interface Type: CAN, I2C
• Minimum Operating Temperature: - 40 C
• Program Memory Size: 32 bit
• Cpu Speed: 400MHz
• Embedded Interface Type: CAN, I2C, SPI, UART, USB
• Digital Ic Case Style: TEPBGA
• No. Of Pins: 324
• Rohs Compliant: Yes
• Cpu Family: MPC5xx
• Device Core Size: 32b
• Frequency (max): 400MHz
• Total Internal Ram Size: 32KB
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 324
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Suggested reading
This section lists additional reading that provides background for the information in this manual as well as
general information about PowerPC architecture.
General information
Useful information about the PowerPC architecture and computer architecture in general:
PowerPC documentation
PowerPC documentation is available from the sources listed on the back cover of this manual, as well as
http://www.freescale.com/powerarchitecture
Freescale Semiconductor
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Chapter 30, “SRAM Memory (MEM),”
implementation.
Chapter 31, “Temperature Sensor,”
the MPC5125.
Chapter 32, “Universal Serial Bus Interface with On-The-Go,”
(USB) interface on the MPC5125.
Appendix A, “Memory Map,”
MPC5125.
Programming Environments Manual for 32-Bit Implementations of the PowerPC™ Architecture
(MPCFPE32B)
Using Microprocessors and Microcomputers: The Motorola Family, William C. Wray, Ross
Bannatyne, Joseph D. Greenfield
Computer Architecture: A Quantitative Approach, Second Edition, by John L. Hennessy and David
A. Patterson.
Computer Organization and Design: The Hardware/Software Interface, Second Edition, David A.
Patterson and John L. Hennessy.
Reference manuals (formerly called user’s manuals)—These books provide details about
individual PowerPC implementations and are intended to be used in conjunction with the PowerPC
Programmers Reference Manual.
Addenda/errata to reference manuals—Because some processors have follow-on parts, an
addendum is provided that describes the additional features and functionality changes. Also, if
mistakes are found within a reference manual, an errata document will be issued before the next
published release of the reference manual. These addenda/errata are intended for use with the
corresponding reference manuals.
Data sheets—Data sheets provide specific information regarding pin-out diagrams, bus timing,
signal behavior, and AC, DC, and thermal characteristics, as well as other design considerations.
Product briefs—Each device has a product brief that provides an overview of its features. This
document is roughly equivalent to the overview (Chapter 1) of a device’s reference manual.
MPC5125 Microcontroller Reference Manual, Rev. 2
provides a detailed listing of the memory-mapped registers for the
describes the module that monitors the internal temperature of
.
describes the on-chip static RAM (SRAM)
describes the universal serial bus
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