MPC5125YVN400 Freescale Semiconductor, MPC5125YVN400 Datasheet - Page 261

• Manufacturer Part Number: MPC5125YVN400
• Description: IC MCU 32BIT E300 324TEPBGA
• Manufacturer: Freescale Semiconductor
• Series: MPC51xxr

Specifications of MPC5125YVN400

• Core Processor: e300
• Core Size: 32-Bit
• Speed: 400MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, USB OTG
• Peripherals: DMA, WDT
• Number Of I /o: 64
• Program Memory Type: ROMless
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 1.33 V ~ 1.47 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 324-PBGA
• Processor Series: MPC51xx
• Core: e300
• Data Bus Width: 32 bit
• Development Tools By Supplier: TWR-MPC5125-KIT, TWR-SER, TWR-ELEV, TOWER
• Maximum Clock Frequency: 400 MHz
• Operating Supply Voltage: 1.4 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Data Ram Size: 32 KB
• I/o Voltage: 3.3 V
• Interface Type: CAN, I2C
• Minimum Operating Temperature: - 40 C
• Program Memory Size: 32 bit
• Cpu Speed: 400MHz
• Embedded Interface Type: CAN, I2C, SPI, UART, USB
• Digital Ic Case Style: TEPBGA
• No. Of Pins: 324
• Rohs Compliant: Yes
• Cpu Family: MPC5xx
• Device Core Size: 32b
• Frequency (max): 400MHz
• Total Internal Ram Size: 32KB
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 324
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Execute as:
When minor loop linking is enabled (TCD.CITER.E_LINK = 1), the TCD.CITER field uses a 9-bit vector
to form the current iteration count.
When minor loop linking is disabled (TCD.CITER.E_LINK = 0), the TCD.CITER field uses a 15-bit
vector to form the current iteration count. The bits associated with the TCD.CITER.LINKCH field are
concatenated onto the CITER value to increase the range of the CITER.
9.3.7
This section provides recommended methods to change the programming model during channel execution.
9.3.7.1
The following two options are recommended for dynamically changing channel priority levels:
The following two options are available for dynamically changing group priority levels:
9.3.7.2
Dynamic channel linking and dynamic scatter/gather is the process of changing the
TCD.MAJOR.E_LINK or TCD.E_SG bits during channel execution. These bits are read from the TCD
local memory at the end of channel execution, allowing you to enable either feature during channel
execution.
Because you can change the configuration during execution, a coherency model is needed. Consider the
scenario where you attempt to execute a dynamic channel link by enabling the TCD.MAJOR.E_LINK bit
at the same time the DMA_ENGINE is retiring the channel. The TCD.MAJOR.E_LINK would be set in
Freescale Semiconductor
1. Minor loop done → set channel 12 TCD.START bit.
2. Minor loop done → set channel 12 TCD.START bit.
3. Minor loop done → set channel 12 TCD.START bit.
4. Minor loop done, major loop done → set channel 7 TCD.START bit.
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Switch to round-robin channel arbitration mode, change the channel priorities, and then switch
back to fixed arbitration mode
Disable all the channels within a group, change the channel priorities within that group only, and
then enable the appropriate channels.
Switch to round-robin group arbitration mode, change the group priorities, and then switch back to
fixed arbitration mode,
Disable all channels, change the group priorities, and then enable the appropriate channels.
Dynamic Programming
Dynamic Priority Changing
Dynamic Channel Linking and Dynamic Scatter/Gather
The TCD.CITER.E_LINK bit and the TCD.BITER.E_LINK bit must equal
or a configuration error is reported. The CITER and BITER vector widths
must be equal to calculate the major loop, half-way done interrupt point.
MPC5125 Microcontroller Reference Manual, Rev. 2
NOTE
Direct Memory Access (DMA)
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