MPC5125YVN400 Freescale Semiconductor, MPC5125YVN400 Datasheet - Page 101

IC MCU 32BIT E300 324TEPBGA

MPC5125YVN400

Manufacturer Part Number
MPC5125YVN400
Description
IC MCU 32BIT E300 324TEPBGA
Manufacturer
Freescale Semiconductor
Series
MPC51xxr

Specifications of MPC5125YVN400

Core Processor
e300
Core Size
32-Bit
Speed
400MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, USB OTG
Peripherals
DMA, WDT
Number Of I /o
64
Program Memory Type
ROMless
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
1.33 V ~ 1.47 V
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
324-PBGA
Processor Series
MPC51xx
Core
e300
Data Bus Width
32 bit
Development Tools By Supplier
TWR-MPC5125-KIT, TWR-SER, TWR-ELEV, TOWER
Maximum Clock Frequency
400 MHz
Operating Supply Voltage
1.4 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Data Ram Size
32 KB
I/o Voltage
3.3 V
Interface Type
CAN, I2C
Minimum Operating Temperature
- 40 C
Program Memory Size
32 bit
Cpu Speed
400MHz
Embedded Interface Type
CAN, I2C, SPI, UART, USB
Digital Ic Case Style
TEPBGA
No. Of Pins
324
Rohs Compliant
Yes
Cpu Family
MPC5xx
Device Core Size
32b
Frequency (max)
400MHz
Total Internal Ram Size
32KB
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
324
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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Quantity
Price
Part Number:
MPC5125YVN400
Manufacturer:
Freescale Semiconductor
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Chapter 5
Clocks and Low-Power Modes
5.1
The wide range of applications supported by the MPC5125 requires a complex clocking structure with
different primary clock domains derived from an oscillator source. Internal PLL and clock dividers allow
generation of a wide range of clock references.
Each peripheral clock may be individually controlled to minimize total power consumption of the device.
Clocks may be gated individually or scaled in frequency to ensure the most efficient power profile for the
user’s application.
5.2
The system reference is provided by a crystal oscillator that drives the system PLL. This PLL is
programmed at reset by the reset configuration word (RST_CONF) sampled at the rising edge
(deassertion) of power on reset (PORESET). See
SYS_PLL clock is then divided (SYS_DIV) and used as a reference to the MPC5125 cores and
peripherals.
Freescale Semiconductor
XTALO
RST_CONF_SYSOSCEN
XTALI
Introduction
System Clock Generation
SYS_
OSC
REF_CLK
SPMF[3:0]
SYS
PLL
MPC5125 Microcontroller Reference Manual, Rev. 2
SPLL_OUT
Figure 5-1. MPC5125 Clock System
SYSDIV[5:0]
SYS_DIV
Section 4.2, “(PORESET) Power-On Initialization.”
SYS_CLK
1/2
Power Arch.
CPMF[3:0]
IPS_DIV
PLL
ddr_clk
SDHC_DIV
LPC_DIV
NFC_DIV
DIU_DIV
1/2
sdhc1_clk
nfc_flash_clk
sdhc2_clk
diu_clk
DDR
Memory
Device
csb_clk
ppc_clk
ips_clk
lpc_clk
The
5-1

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