MPC8536DS Freescale Semiconductor, MPC8536DS Datasheet - Page 707

• Manufacturer Part Number: MPC8536DS
• Description: BOARD DEV SYSTEM MPC8536E
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC III™r
• Type: MPUr

Specifications of MPC8536DS

• Contents: Board, Software and Documentation
• Processor Series: MPC85xx
• Core: e500
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 667 MHz
• Operating Supply Voltage: - 0.3 V to + 1.21 V
• Maximum Operating Temperature: + 105 C
• Data Ram Size: 32 KB
• Interface Type: SPI, USB
• Program Memory Type: DDR2, DDR3, SDRAM
• Core Size: 32 Bit
• Program Memory Size: 544KB
• Cpu Speed: 1.5GHz
• Digital Ic Case Style: BGA
• No. Of Pins: 783
• Supply Voltage Range: 0.95V To 1.05V
• Rohs Compliant: Yes
• For Use With/related Products: MPC8536
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

13.4.3.2
FCM has a fully general command and data transfer sequencer that caters for both common and
specific/proprietary NAND Flash command sequences. The command sequencer reads a program out of
the FIR register, which can hold up to 8 instructions, each represented by a 4-bit op-code, as illustrated in
Figure
likewise to subsequent instructions, ending at FIR[OP7] or until the only instructions remaining are NOPs.
If FIR contains nothing but NOP instructions, FCM will not assert LCSn, otherwise, LCSn is asserted prior
to the first instruction and remains asserted until the last instruction has completed. If LTESR[CC] is
enabled, completion of the last instruction will trigger a command completion event interrupt from eLBC.
Prior to executing a sequence, necessary operands for the instructions will need to be set in the FMR, FCR,
MDR, FBCR, FBAR, and FPAR registers. The AS0–AS3 address and data pointers associated with FCM’s
use of MDR all reset to select AS0 at the start of the instruction sequence. A complete list of op-codes can
be found in
Freescale Semiconductor
ECCM
0
1
13-53. The first instruction executed is read from FIR[OP0], the next is read from FIR[OP1], and
Byte 0
Figure 13-52. ECC Placement in NAND Flash Spare Regions in Relation to FMR[ECCM]
Section 13.3.1.18, “Flash Instruction Register (FIR).”
FBAR Register
FBCR Register
FPAR Register
Programming FCM
MDR Register
FMR Register
FCR Register
Main Region
Main Region
MPC8536E PowerQUICC III Integrated Processor Reference Manual, Rev. 1
MDR AS select
Byte 511 Other Mains Spare 0
Figure 13-53. FCM Instruction Sequencer Mechanism
OP0
FCM Instruction
Buffer
NAND Flash
Bus Signal
Generator
4 bits
op-code
4 bits
OP1
—
data
8 bits
OP2
Flash instruction shift register
—
5
EC0 EC1 EC2
OP3
FIR Register
LAD[0:7]
LFWE
LFCLE
LFALE
LFRE
LFRB
LFWP
6
7
parallel load on FCM bank select
OP4
EC0 EC1 EC2
8
OP5
9
10
OP6
Enhanced Local Bus Controller
11
—
12
OP7
—
13
NOP
14
13-65
15