MPC8536DS Freescale Semiconductor, MPC8536DS Datasheet - Page 1688

• Manufacturer Part Number: MPC8536DS
• Description: BOARD DEV SYSTEM MPC8536E
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC III™r
• Type: MPUr

Specifications of MPC8536DS

• Contents: Board, Software and Documentation
• Processor Series: MPC85xx
• Core: e500
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 667 MHz
• Operating Supply Voltage: - 0.3 V to + 1.21 V
• Maximum Operating Temperature: + 105 C
• Data Ram Size: 32 KB
• Interface Type: SPI, USB
• Program Memory Type: DDR2, DDR3, SDRAM
• Core Size: 32 Bit
• Program Memory Size: 544KB
• Cpu Speed: 1.5GHz
• Digital Ic Case Style: BGA
• No. Of Pins: 783
• Supply Voltage Range: 0.95V To 1.05V
• Rohs Compliant: Yes
• For Use With/related Products: MPC8536
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

D–D
Coherency rules
Commands
Communications processor module (CPM)
Configuration
Configuration space
Configuration, control, and status
Index-2
device clock signals summary, 4-3
device clocking operation, 4-24–4-27
eTSEC
I
LBC bus clocks and clock ratios, 13-4
PCI/PCI-X clocking, 16-45, 16-50
POR settings
L2 cache, 6-28
PCI, see PCI/PCI-X controller
serial peripheral interface (SPI)
DDR, 8-12–8-51, 8-62
ECM
eTSEC interfaces, 14-207–??
LBC
PCI/PCI-X
PIC
POR, see Power-on-reset (POR)
PCI Express, 17-43
PCI/PCI-X addressing, 16-48
accessing CCSR memory from external masters, 2-11
accessing CCSRs, 4-4
alternate configuration space (ALTBAR and ALTCAR),
boot page translation, 4-7
2
C
see also Signals, clock
CCB (platform) clock, 4-24
Ethernet clocks, 4-26
PCI Express clocks, 4-25
system clock/PCI clock, 4-24
inputs and outputs, 14-10
management clock out (EC_MDC), 14-11, 14-81
clock stretching, 11-17
clock synchronization, 11-16
input synchronization and digital filter, 11-16
clock ratio register (LCRR), 13-34
e500 core PLL ratio, 4-12
system/CCB PLL ratio, 4-11
multi-master operation, 18-3
CCB address configuration register (EEBACR), 7-3
CCB port configuration register (EEBPCR), 7-4
configuration register (LBCR), 13-32
configuration access registers, 16-60
configuration cycles, 16-58
configuration space header, 16-58
global configuration register, 9-21
minimum CCB frequency equations, 4-26
4-5
MPC8536E PowerQUICC III Integrated Processor Reference Manual, Rev. 1
Context ID registers, 25-22–25-23
Controller registers, 10-50
Crypto-channel
Crypto-channel registers, 10-37
CTS, see DUART_CTS[0:1]
D
Data cache
Data encryption standard execution units (DEU), 10-57,
DDR controller
CCSR memory map, 2-10–2-14
CCSRBAR update guidelines, 4-4
memory map/register definition, 4-3
organization of CCSR memory, 2-11
configuration register, 10-37
see L2 cache/SRAM
address signal mappings, 8-5
battery-backed RAM and forced self-refresh mode, 8-94
block diagram, 8-2, 8-60
clock distribution, 8-76
clocks
configuration, example, 8-62
data beat ordering, 8-83
debug mode
driver impedance calibration, 8-9
error checking and correcting (ECC), 6-39, 8-84
error handling, 8-53, 8-86
features, 8-2
functional description, 8-60
initialization/application information, 8-87
interrupts, 8-57
memory map/register definition, 8-10
modes of operation, 8-3
on-die termination for CSs, 8-9
page mode and logical bank retention, 8-83
performance monitor events, 24-17
register descriptions, 8-12
SDRAM operation, 8-64
10-108, 10-117
disabling, 23-32, 23-33
signal selection (POR), 4-23
source and target ID, 25-4, 25-24
testing ECC with error injection, 8-51–8-53
programming different memory types, 8-89
by acronym, see Register Index
configuration registers, 8-12–8-51
error handling registers, 8-53–8-60
error injection registers, 8-51–8-53
address multiplexing, 8-66
initialization sequence, 8-94
JEDEC standard interface commands, 8-71
mode-set command timing, 8-76
Freescale Semiconductor
Index