MPC8536DS Freescale Semiconductor, MPC8536DS Datasheet - Page 353

BOARD DEV SYSTEM MPC8536E

MPC8536DS

Manufacturer Part Number
MPC8536DS
Description
BOARD DEV SYSTEM MPC8536E
Manufacturer
Freescale Semiconductor
Series
PowerQUICC III™r
Type
MPUr
Datasheets

Specifications of MPC8536DS

Contents
Board, Software and Documentation
Processor Series
MPC85xx
Core
e500
Data Bus Width
32 bit
Maximum Clock Frequency
667 MHz
Operating Supply Voltage
- 0.3 V to + 1.21 V
Maximum Operating Temperature
+ 105 C
Data Ram Size
32 KB
Interface Type
SPI, USB
Program Memory Type
DDR2, DDR3, SDRAM
Core Size
32 Bit
Program Memory Size
544KB
Cpu Speed
1.5GHz
Digital Ic Case Style
BGA
No. Of Pins
783
Supply Voltage Range
0.95V To 1.05V
Rohs Compliant
Yes
For Use With/related Products
MPC8536
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Figure 8-55
8.5.8
The DDR memory controller supports auto-refresh and self-refresh. Auto refresh is used during normal
operation and is controlled by the DDR_SDRAM_INTERVAL[REFINT] value; self-refresh is used only
when the DDR memory controller is set to enter a sleep power management state. The REFINT value,
which represents the number of memory bus clock cycles between refresh cycles, must allow for possible
outstanding transactions to complete before a refresh request is sent to the memory after the REFINT value
is reached. If a memory transaction is in progress when the refresh interval is reached, the refresh cycle
waits for the transaction to complete. In the worst case, the refresh cycle must wait the number of bus clock
cycles required by the longest programmed access. To ensure that the latency caused by a memory
transaction does not violate the device refresh period, it is recommended that the programmed value of
REFINT be less than that required by the SDRAM.
When a refresh cycle is required, the DDR memory controller does the following:
Freescale Semiconductor
1. Completes all current memory requests.
2. Closes all open pages with a PRECHARGE-ALL command to each DDR SDRAM bank with an
3. Issues one or more auto-refresh commands to each DDR SDRAM bank (as identified by its chip
open page (as indicated by the row open table).
select) to refresh one row in each logical bank of the selected physical bank.
SDRAM Clock
DDR SDRAM Refresh
shows the use of the WR_DATA_DELAY parameter.
MDM n
MDQS
MDM n
MDQS
MRAS
MCAS
MDQ n
MDQ n
MWE
MCS
MA n
Figure 8-55. Write Timing Adjustments Example for Write Latency = 1
MPC8536E PowerQUICC III Integrated Processor Reference Manual, Rev. 1
ROW
0
1
ACTTORW
2
3
COL
4
D0
D0
5
D1 D2 D3
D1 D2 D3
COL
6
00
00
D0
D0
7
D1 D2
D1 D2
8
D3
D3
9
10
11
DDR Memory Controller
12
1/4 Delay
1/2 Delay
8-79

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