MC68F375BGMZP33 Freescale Semiconductor, MC68F375BGMZP33 Datasheet - Page 36

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MC68F375BGMZP33

Manufacturer Part Number
MC68F375BGMZP33
Description
IC MPU 32BIT 33MHZ 217-PBGA
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MC68F375BGMZP33

Processor Type
M683xx 32-Bit
Speed
33MHz
Voltage
5V
Mounting Type
Surface Mount
Package / Case
217-PBGA
Processor Series
M683xx
Core
CPU32
Data Bus Width
32 bit
Program Memory Type
Flash
Program Memory Size
256 KB
Data Ram Size
10 KB
Interface Type
SPI, SCI, CAN
Maximum Clock Frequency
16 MHz
Number Of Programmable I/os
48
Number Of Timers
16
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 16 Channel
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-
Lead Free Status / Rohs Status
No

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC68F375BGMZP33
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
MC68F375
REFERENCE MANUAL
• Time processing unit (TPU3):
• 6-Kbyte TPU emulation RAM (DPTRAM).
• 256K Byte 1T Flash EEPROM (CMFI).
• SRAM
• Late programmable read only memory – ROM:
• CAN2.0B controller module (TouCAN ):
• Configurable timer module 9 (CTM9):
— Dual function I/O port pins.
— 16 channels – each is associated with a pin.
— Each channel can perform any time function.
— Each time function may be assigned to more than one channel.
— Each channel has an event register comprised of: 16-bit capture register, 16-
— Each channel can be programmed to perform match or capture operations
— TCR1 is clocked from the internal TPU3 system clock.
— TCR2 may be clocked or gated from the external T2CLK pin.
— All time primitives are microcoded.
— 4 Kbytes of microstore program ROM space.
— All channels have eight 16-bit parameter registers.
— A hardware scheduler with three priority levels is included.
— Resolution is one system clock period.
— Modulus prescaler (DIV 2, 4, 6...... 62, 64)
— Can be used as system RAM or TPU microcode storage.
— External V
— 8-Kbyte static RAM (SRAM):
— 4 x 512-byte static RAM (SRAM):
— 512-byte modules can overlay any 512-byte portion (on 512-byte boundaries)
— 8-Kbyte array, accessible as bytes or words.
— User selectable default base address.
— User selectable bootstrap ROM function.
— Full implementation of CAN protocol specification – Version 2.0B.
— Standard/extended data and remote frames (up to 109/127 bits long).
— Programmable bit rate up to 1 Mbit/sec, derived from system clock.
— 16 Rx/Tx message buffers of 0-8 bytes data length, of which 2 buffers are con-
— Programmable global Rx masks.
— Programmable transmit-first scheme: lowest ID or lowest buffer number.
— Low power “SLEEP” mode, with programmable “WAKE UP” on bus activity.
— Automatic time-stamping of received and transmitted messages.
— 1 bus interface unit submodule (BIUSM).
— 1 counter prescaler submodule (CPSM).
— 1 free-running counter submodule (FCSM).
bit compare/match register, 16-bit greater-than-or-equal-to comparator.
with one or both of the two 16-bit free running timer count registers (TCR1 and
TCR2).
of the CMFI module.
figurable to work as Rx buffers with specific programmable masks.
5 V program/erase.
Block 0 protected by an external pin.
STBY
Freescale Semiconductor, Inc.
For More Information On This Product,
pin for separate standby supply.
OVERVIEW DESCRIPTION
Go to: www.freescale.com
Rev. 25 June 03
MOTOROLA
1-2

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