MC68F375BGMZP33 Freescale Semiconductor, MC68F375BGMZP33 Datasheet - Page 30

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MC68F375BGMZP33

Manufacturer Part Number
MC68F375BGMZP33
Description
IC MPU 32BIT 33MHZ 217-PBGA
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MC68F375BGMZP33

Processor Type
M683xx 32-Bit
Speed
33MHz
Voltage
5V
Mounting Type
Surface Mount
Package / Case
217-PBGA
Processor Series
M683xx
Core
CPU32
Data Bus Width
32 bit
Program Memory Type
Flash
Program Memory Size
256 KB
Data Ram Size
10 KB
Interface Type
SPI, SCI, CAN
Maximum Clock Frequency
16 MHz
Number Of Programmable I/os
48
Number Of Timers
16
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 16 Channel
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-
Lead Free Status / Rohs Status
No

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC68F375BGMZP33
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Freescale Semiconductor, Inc.
Page
Table
Number
Number
13-21 CPCR Bit Settings ......................................................................................... 13-54
13-22 Prescaler Division Ratio Select...................................................................... 13-54
A-1 TouCAN (CAN 2.0B Controller)............................................................................. A-2
A-2 CTM9 (Configurable Timer Module)...................................................................... A-4
A-3 QADC64 (Queued Analog-to-Digital Converter) ................................................... A-7
A-4 CMFI (CDR MoneT FLASH FOR THE IMB3) ....................................................... A-8
A-5 ROM Module ......................................................................................................... A-8
A-6 Overlay SRAM Modules (Static Random Access Memory).................................. A-9
A-7 DPTRAM (Dual-Port TPU RAM) ........................................................................... A-9
A-8 SCIM2E (Single-Chip Integration Module) ..........................................................A-10
A-9 SRAM Module (Static Random Access Memory)................................................A-12
A-10 QSMCM (Queued Serial Multi-Channel Module) .............................................. A-12
A-11 TPU3 (Time Processor Unit) ............................................................................. A-14
D-1 Bank 0 Functions ..................................................................................................D-2
D-2 Bank 1 Functions ..................................................................................................D-2
D-3 QOM Bit Encoding ................................................................................................D-5
D-4 SIOP Function Valid CHAN_Control Options......................................................D-44
D-5 SIOP State Timing ..............................................................................................D-46
E-1 Absolute Maximum Ratings................................................................................... E-1
E-2 Thermal Characteristics ........................................................................................E-2
E-3 DC Characteristics ................................................................................................E-2
E-4 Clock Control Timing............................................................................................. E-5
E-5 AC Timing.............................................................................................................. E-6
E-6 Background Debugging Mode Timing ................................................................. E-17
E-7 ECLK Bus Timing ................................................................................................ E-18
E-8 QSPI Timing ........................................................................................................E-20
E-9 Time Processor Unit (TPU3) Timing ...................................................................E-23
E-10 QADC64 Maximum Ratings .............................................................................. E-24
E-11 QADC64 DC Electrical Characteristics (Operating) .......................................... E-25
E-12 QADC64 AC Electrical Characteristics (Operating) .......................................... E-26
E-13 QADC64 Conversion Characteristics (Operating)............................................. E-27
E-14 AMUX_HV Absolute Maximum Ratings ............................................................ E-28
E-15 AMUX_HV DC Electrical Characteristics (Operating) .......................................E-28
E-16 AMUX_HV Conversion Characteristics (Operating).......................................... E-29
E-17 CTM9 5 V, 16.78 MHz Operating Conditions .................................................... E-29
E-18 CTM9 5 V, 25 MHz Operating Conditions .........................................................E-29
E-19 FCSM Timing Characteristics............................................................................E-30
E-20 MCSM Timing Characteristics........................................................................... E-30
E-21 SASM Timing Characteristics............................................................................E-31
E-22 DASM Timing Characteristics ........................................................................... E-31
E-23 PWMSM Timing Characteristics........................................................................ E-32
E-24 TouCAN AC Characteristics.............................................................................. E-32
E-25 CMFI Program and Erase Characteristics.........................................................E-33
MC68F375
LIST OF TABLES
MOTOROLA
REFERENCE MANUAL
Rev. 25 June 03
xxx
For More Information On This Product,
Go to: www.freescale.com

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