MPC8544VTALF Freescale Semiconductor, MPC8544VTALF Datasheet - Page 707
![MPU POWERQUICC III 783-PBGA](/photos/37/62/376266/mpc8544e_image_sml.jpg)
MPC8544VTALF
Manufacturer Part Number
MPC8544VTALF
Description
MPU POWERQUICC III 783-PBGA
Manufacturer
Freescale Semiconductor
Datasheets
1.MPC8544VTALF.pdf
(117 pages)
2.MPC8544VTALF.pdf
(2 pages)
3.MPC8544VTALF.pdf
(1340 pages)
Specifications of MPC8544VTALF
Processor Type
MPC85xx PowerQUICC III 32-Bit
Speed
667MHz
Voltage
1V
Mounting Type
Surface Mount
Package / Case
783-FCPBGA
Processor Series
MPC85xx
Core
e500
Data Bus Width
32 bit
Maximum Clock Frequency
667 MHz
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Data Ram Size
32 KB
I/o Voltage
1.8 V, 3.3 V
Interface Type
I2C, HSSI, DUART
Minimum Operating Temperature
0 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MPC8544VTALF
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Company:
Part Number:
MPC8544VTALFA
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
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14.5.4.3
This section describes limitations of the local bus SDRAM machine.
14.5.4.3.1
LSDMR[BSMA] is used to multiplex the bank select address. The BSMA field and corresponding
multiplexed address are shown below:
Note that LA12 is the latched value of LAD12.
The highest address signals that the bank selects can be multiplexed with are LA[12:13], which limits the
signals for the row address to LA[14:31]. For a 32-bit port, the maximum width of the local bus, LA[30:31]
are not connected, and the maximum row is LA[14:29]. The local bus SDRAM machine supports 15 rows,
which is sufficient for all devices.
14.5.4.3.2
Page-based interleaving allows bank signals to be multiplexed to the higher-order address signals to leave
room for future upgrades. For example, a user could multiplex the bank select signals to LA[14:15],
leaving LA16 to connect to the address signal for a larger memory size.
This allows the system designer to design one board that can be used with a current generation of SDRAM
devices and upgraded to the next generation without requiring a new board layout.
Freescale Semiconductor
000 LA12–LA13
001 LA13–LA14
…
111 LA19–LA20
MPC8544E PowerQUICC III Integrated Host Processor Family Reference Manual, Rev. 1
SDRAM Machine Limitations
Analysis of Maximum Row Number Due to Bank Select Multiplexing
Bank Select Signals
Local Bus Controller
14-87
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