R5F61665N50FPV Renesas Electronics America, R5F61665N50FPV Datasheet - Page 972

MCU FLASH 512K ROM 144-LQFP

R5F61665N50FPV

Manufacturer Part Number
R5F61665N50FPV
Description
MCU FLASH 512K ROM 144-LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8SX/1600r
Datasheet

Specifications of R5F61665N50FPV

Core Processor
H8SX
Core Size
16/32-Bit
Speed
50MHz
Connectivity
EBI/EMI, I²C, IrDA, SCI, SmartCard, USB
Peripherals
DMA, LVD, POR, PWM, WDT
Number Of I /o
92
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
40K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
R5F61665N50FPV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 19 Serial Communication Interface (SCI, IrDA, CRC)
TDRE
TEND
FER/ERS
Note that the TEND flag is set in different timings depending on the GM bit setting in SMR.
Figure 19.30 shows the TEND flag set timing.
Rev. 2.00 Oct. 21, 2009 Page 938 of 1454
REJ09B0498-0200
I/O data
TXI
(TEND interrupt)
Ds
[Legend]
Ds:
D0 to D7: Data bits
Dp:
DE:
Transfer from TDR to TSR
Figure 19.29 Data Re-Transfer Operation in SCI Transmission Mode
GM = 0
GM = 1
D0 D1 D2 D3 D4 D5 D6 D7 Dp DE
Figure 19.30 TEND Flag Set Timing during Transmission
nth transfer frame
Start bit
Parity bit
Error signal
Ds
D0
D1
[1]
D2
[2]
Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp
D3
Transfer from TDR to TSR
11.0 etu
12.5 etu
D4
Retransfer frame
D5
D6
D7
Dp
(DE)
[3]
[4]
Guard time
DE
Ds D0 D1 D2 D3 D4
Transfer from TDR to TSR
transfer frame
(n + 1) th

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