R5F61665N50FPV Renesas Electronics America, R5F61665N50FPV Datasheet - Page 1429

MCU FLASH 512K ROM 144-LQFP

R5F61665N50FPV

Manufacturer Part Number
R5F61665N50FPV
Description
MCU FLASH 512K ROM 144-LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8SX/1600r
Datasheet

Specifications of R5F61665N50FPV

Core Processor
H8SX
Core Size
16/32-Bit
Speed
50MHz
Connectivity
EBI/EMI, I²C, IrDA, SCI, SmartCard, USB
Peripherals
DMA, LVD, POR, PWM, WDT
Number Of I /o
92
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
40K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
R5F61665N50FPV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
(DKC = 0) DACK3 to DACK0
(DKC = 1) DACK3 to DACK0
Read
Write
Figure 30.19 DRAM Access Timing: Two-State Access
Note:
A23 to A0
RAS
LUCAS, LLCAS
OE, RD
WE
D15 to D0
OE, RD
WE
D15 to D0
AS
BS
RD/WR
RD/WR
Timming of DACK when DDS = 0 and EDDS = 0
Timming of RAS when RAST = 0
t
t
AD
RWD
t
RWD
Tp
t
AS3
t
PCH2
t
Tr
DACD2
t
CSD2
t
AH1
t
DACD1
t
t
BSD
Rev. 2.00 Oct. 21, 2009 Page 1395 of 1454
t
WRD2
WDD
t
AD
Tc1
t
AC4
t
t
OED1
WDS1
Section 30 Electrical Characteristics
t
WCS1
t
AA3
t
BSD
t
WCH1
t
AC1
Tc2
t
WDH2
t
CASW1
t
RDS2
t
WRD2
t
RDH2
t
RWD
t
t
t
OED1
RWD
DACD2
t
REJ09B0498-0200
DACD2
t
CSD3

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