R5F61665N50FPV Renesas Electronics America, R5F61665N50FPV Datasheet - Page 1182

MCU FLASH 512K ROM 144-LQFP

R5F61665N50FPV

Manufacturer Part Number
R5F61665N50FPV
Description
MCU FLASH 512K ROM 144-LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8SX/1600r
Datasheet

Specifications of R5F61665N50FPV

Core Processor
H8SX
Core Size
16/32-Bit
Speed
50MHz
Connectivity
EBI/EMI, I²C, IrDA, SCI, SmartCard, USB
Peripherals
DMA, LVD, POR, PWM, WDT
Number Of I /o
92
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
40K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
R5F61665N50FPV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 25 Flash Memory
25.8.1
SCI Boot mode executes programming/erasure of the user MAT or user boot MAT by means of
the control command and program data transmitted from the externally connected host via the on-
chip SCI_4.
In SCI boot mode, the tool for transmitting the control command and program data, and the
program data must be prepared in the host. The serial communications mode is set to
asynchronous mode. The system configuration in boot mode is shown in figure 25.6. Interrupts are
ignored in SCI boot mode. Configure the user system so that interrupts do not occur.
Rev. 2.00 Oct. 21, 2009 Page 1148 of 1454
REJ09B0498-0200
tool and program
Boot Mode
Programming
Host
data
Figure 25.6 System Configuration in Boot Mode
Control command,
program data
Response
RxD4
TxD4
Software for
analyzing
control
commands
(on-chip)
SCI_4
This LSI
On-chip
memory
Flash
RAM
MD3 to MD0
PM2
0
0010

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