R5F61665N50FPV Renesas Electronics America, R5F61665N50FPV Datasheet - Page 1444

MCU FLASH 512K ROM 144-LQFP

R5F61665N50FPV

Manufacturer Part Number
R5F61665N50FPV
Description
MCU FLASH 512K ROM 144-LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8SX/1600r
Datasheet

Specifications of R5F61665N50FPV

Core Processor
H8SX
Core Size
16/32-Bit
Speed
50MHz
Connectivity
EBI/EMI, I²C, IrDA, SCI, SmartCard, USB
Peripherals
DMA, LVD, POR, PWM, WDT
Number Of I /o
92
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
40K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
R5F61665N50FPV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 30 Electrical Characteristics
30.4.4
Table 30.9 DMAC and EXDMAC Timing
Conditions: V
Note:
Rev. 2.00 Oct. 21, 2009 Page 1410 of 1454
REJ09B0498-0200
BACK
BREQO
Item
DREQ setup time
DREQ hold time
TEND delay time
DACK delay time 1
DACK delay time 2
EDREQ setup time
EDREQ hold time
ETEND delay time
EDACK delay time 1
EDACK delay time 2
EDRAK delay time
*
DMAC and EXDMAC Timing
V
CC
V
T
T
a
a
CC
ref
= PLLV
= –20°C to +75°C (regular specifications),
= –40°C to +85°C (wide-range specifications)
= 3.0 V to AV
= PLLV
Figure 30.36 External Bus Request Output Timing
CC
= DrV
CC
= DrV
CC
CC
= 2.95 V to 3.60 V in the H8SX/1665M Group.
, V
CC
SS
= 3.0 V to 3.6 V*, AV
Symbol
t
t
t
t
t
t
t
t
t
t
t
DRQS
DRQH
TED
DACD1
DACD2
DRQS
DRQH
TED
DACD1
DACD2
EDRKD
= PLLV
t
BRQOD
SS
= DrV
Min.
20
5
20
5
SS
= AV
CC
Max.
15
15
15
15
15
15
15
= 3.0 V to 3.6 V,
SS
= 0 V, Bφ = 8 MHz to 50 MHz,
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
t
BRQOD
Test Conditions
Figure 30.37
Figure 30.38
Figure 30.39
Figure 30.40
Figure 30.37
Figure 30.38
Figure 30.39
Figure 30.40
Figure 30.41

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