R5F61665N50FPV Renesas Electronics America, R5F61665N50FPV Datasheet - Page 1432

• Manufacturer Part Number: R5F61665N50FPV
• Description: MCU FLASH 512K ROM 144-LQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8SX/1600r

Specifications of R5F61665N50FPV

• Core Processor: H8SX
• Core Size: 16/32-Bit
• Speed: 50MHz
• Connectivity: EBI/EMI, I²C, IrDA, SCI, SmartCard, USB
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number Of I /o: 92
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 40K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Section 30 Electrical Characteristics
Rev. 2.00 Oct. 21, 2009 Page 1398 of 1454
REJ09B0498-0200
(DKC = 0) DACK3 to DACK0
(DKC = 1) DACK3 to DACK0
Read
Write
Figure 30.22 DRAM Access Timing: Three-State Access (RAST = 1)
Note:
BS
RD/WR
Bφ
A23 to A0
RAS
LUCAS, LLCAS
RD/WR
OE, RD
WE
D15 to D0
OE, RD
WE
D15 to D0
AS
Timming of DACK when DDS = 0 and EDDS = 0
Timming of RAS when RAST = 1
t
AD
t
RWD
t
RWD
Tp
t
AS2
t
PCH1
t
t
BSD
DACD2
t
CSD2
Tr
t
AH2
t
DACD1
t
t
BSD
AD
t
WRD2
t
WDD
Tc1
t
AC7
t
t
t
WCS2
WDS2
OED2
t
AA5
Tc2
t
WCH2
t
CASW2
t
AC2
t
WDH3
Tc3
t
RDS2
t
WRD2
t
RDH2
t
t
RWD
t
RWD
t
DACD2
t
t
OED1
CSD3
DACD2