R5F61665N50FPV Renesas Electronics America, R5F61665N50FPV Datasheet - Page 332

MCU FLASH 512K ROM 144-LQFP

R5F61665N50FPV

Manufacturer Part Number
R5F61665N50FPV
Description
MCU FLASH 512K ROM 144-LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8SX/1600r
Datasheet

Specifications of R5F61665N50FPV

Core Processor
H8SX
Core Size
16/32-Bit
Speed
50MHz
Connectivity
EBI/EMI, I²C, IrDA, SCI, SmartCard, USB
Peripherals
DMA, LVD, POR, PWM, WDT
Number Of I /o
92
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
40K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
R5F61665N50FPV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 9 Bus Controller (BSC)
Some DRAMs having the self-refresh mode needs longer precharge time of the RAS signal
immediately after the self-refresh mode than that in normal operation. From one to seven of
precharge cycles immediately after a self-refresh cycle can be inserted. Precharging is also
performed according to bits TPC1 and TPC0 in DRACCR. Set the precharge time so that the
precharge time immediately after a self-refresh cycle is optimal.
Figure 9.57 shows a timing example when one precharge cycle is added.
Rev. 2.00 Oct. 21, 2009 Page 298 of 1454
REJ09B0498-0200
Address bus
Data bus
RD/WR
LUCAS
LLCAS
RAS
Figure 9.57 Timing Example when 1 Precharge Cycle Added
WE
RD
OE
BS
Software standby
T R
c3
T R
c4
T R
p1
High
High
High
T
p
DRAM space write
T
r
T
c1
T
c2

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