R5F61665N50FPV Renesas Electronics America, R5F61665N50FPV Datasheet - Page 1262

• Manufacturer Part Number: R5F61665N50FPV
• Description: MCU FLASH 512K ROM 144-LQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8SX/1600r

Specifications of R5F61665N50FPV

• Core Processor: H8SX
• Core Size: 16/32-Bit
• Speed: 50MHz
• Connectivity: EBI/EMI, I²C, IrDA, SCI, SmartCard, USB
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number Of I /o: 92
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 40K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Section 26 Boundary Scan
CLAMP (Instruction Code: B'0010): When the CLAMP instruction is selected, output pins
output the boundary scan register value which was specified by the SAMPLE/PRELOAD
instruction in advance. While the CLAMP instruction is selected, the status of boundary scan
register is maintained regardless of the TAP controller state. BYPASS is connected between TDI
and TDO, the same operation as BYPASS instruction can be achieved.
This instruction connects the bypass register (JTBPR) between the TDI and TDO pins, leading to
the same operation as when BYPASS mode has been selected.
HIGHZ (Instruction Code: B'0011): When the HIGHZ instruction is selected, all output pins
enter high-impedance state. While the HIGHZ instruction is selected, the status of boundary scan
register is maintained regardless of the state of the TAP controller.
BYPASS is connected between TDI and TDO pins, leading to the same operation as when the
BYPASS instruction has been selected.
Rev. 2.00 Oct. 21, 2009 Page 1228 of 1454
REJ09B0498-0200