R5F61665N50FPV Renesas Electronics America, R5F61665N50FPV Datasheet - Page 1202

MCU FLASH 512K ROM 144-LQFP

R5F61665N50FPV

Manufacturer Part Number
R5F61665N50FPV
Description
MCU FLASH 512K ROM 144-LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8SX/1600r
Datasheet

Specifications of R5F61665N50FPV

Core Processor
H8SX
Core Size
16/32-Bit
Speed
50MHz
Connectivity
EBI/EMI, I²C, IrDA, SCI, SmartCard, USB
Peripherals
DMA, LVD, POR, PWM, WDT
Number Of I /o
92
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
40K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
R5F61665N50FPV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 25 Flash Memory
In user boot mode, though the user boot MAT can be seen in the flash memory space, the user
MAT is hidden in the background. Therefore, the user MAT and user boot MAT are switched
while the user MAT is being programmed. Because the user boot MAT is hidden while the user
MAT is being programmed, the procedure program must be executed in an area other than flash
memory. After programming completes, switch the memory MATs again to return to the first
state.
Memory MAT switching is enabled by setting FMATS. However note that access to a memory
MAT is not allowed until memory MAT switching is completed. During memory MAT switching,
the LSI is in an unstable state, e.g. if an interrupt occurs, from which memory MAT the interrupt
vector is read is undetermined. Perform memory MAT switching in accordance with the
description in section 25.11, Switching between User MAT and User Boot MAT.
Except for memory MAT switching, the programming procedure is the same as that in user
program mode.
The area that can be executed in the steps of the procedure program (on-chip RAM, user MAT,
and external space) is shown in section 25.8.5, On-Chip Program and Storable Area for Program
Data.
Rev. 2.00 Oct. 21, 2009 Page 1168 of 1454
REJ09B0498-0200

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