HH80556KH0364M S LAGD Intel, HH80556KH0364M S LAGD Datasheet - Page 377

• Manufacturer Part Number: HH80556KH0364M S LAGD
• Manufacturer: Intel

Specifications of HH80556KH0364M S LAGD

• Rad Hardened: No
• Lead Free Status / RoHS Status: Compliant

Electrical Characteristics—Intel
6.0
6.1
Warning:
Table 124.
6.1.1
July 2009
Order Number: 318378-005US
T
V
V
Notes:
1.
storage
CC
TT
Symbol
The component storage temperature range (Pre-Board Assembly) is -45 °C to 75 °C for short-term exposure and -10 °C
to 45 °C for sustained exposure. In addition to this storage temperature specification, compliance to the latest IPC/
JEDEC J-STD-033B.1 joint industry standard is required for all Surface Mount Devices (SMDs). This document governs
handling, packing, shipping, and use of moisture/reflow sensitive SMDs.
Electrical Characteristics
Absolute Maximum Ratings
Table 124
Chipset. Functional operation at or exceeding the absolute maximum and minimum
ratings is neither implied nor guaranteed.
Stressing the device beyond the “absolute maximum ratings” may cause permanent
damage. These are stress ratings only. Operating beyond the “operating conditions” is
not recommended and extended exposure beyond “operating conditions” may affect
reliability.
Absolute Maximum Ratings
Storage Temperature
MCH Supply Voltages with Respect to Vss
FSB Termination Supply Voltage Input with Respect to Vss
Thermal Characteristics
See
additional information on thermal characteristics, consult the Intel
Controller Hub Chipset for Communications, Embedded, and Storage Applications
Thermal/Mechanical Design Guide.
Table 135, “Thermal Diode Parameters”
lists the maximum environmental stress ratings for the Intel
®
5100 MCH Chipset
1
Parameter
for the Thermal Diode Parameters. For
Intel
®
-45.0
-0.50
-0.30
Min.
5100 Memory Controller Hub Chipset
®
5100 Memory
Max.
75.0
1.85
1.85
®
5100 MCH
Datasheet
Unit
°C
V
V
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