MCF5253CVM140 Freescale Semiconductor, MCF5253CVM140 Datasheet - Page 115

IC MPU 32BIT 140MHZ 225-MAPBGA

MCF5253CVM140

Manufacturer Part Number
MCF5253CVM140
Description
IC MPU 32BIT 140MHZ 225-MAPBGA
Manufacturer
Freescale Semiconductor
Series
MCF525xr

Specifications of MCF5253CVM140

Core Processor
Coldfire V2
Core Size
32-Bit
Speed
140MHz
Connectivity
CAN, EBI/EMI, I²C, QSPI, UART/USART, USB OTG
Peripherals
DMA, WDT
Program Memory Type
ROMless
Ram Size
128K x 8
Voltage - Supply (vcc/vdd)
1.08 V ~ 1.32 V
Data Converters
A/D 6x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
225-MAPBGA
Family Name
MCF5xxx
Device Core
ColdFire V2
Device Core Size
32b
Frequency (max)
140MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
1.2/3.3V
Operating Supply Voltage (max)
1.32/3.6V
Operating Supply Voltage (min)
1.08/3V
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
225
Package Type
MA-BGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of I /o
-
Eeprom Size
-
Program Memory Size
-
Lead Free Status / Rohs Status
Compliant

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Figure 7-7
SRAS-to-SCAS delay (t
Freescale Semiconductor
D[31:16]
SD_CS0
SDRAS
SDCAS
A[31:0]
UDQM
SDWE
LDQM
BCLK
shows the burst write operation. In this example, DACR[CASL] = 01, which creates an
Data is available upon SCAS assertion and a burst write cycle completes
two cycles sooner than a burst read cycle with the same t
cycle is initiated sooner, but cannot begin an SDRAM cycle until the
precharge-to-
actv
tRCD = 2
RCD
Row
nop
) of 2 BCLK cycles.
ACTV
Figure 7-6. Burst Read SDRAM Access
delay completes.
Column Column Column
MCF5253 Reference Manual, Rev. 1
t
CASL
= 1
read
NOTE
Column
nop
RCD.
Synchronous DRAM Controller Module
nop
t
The next bus
EP
pall
7-11

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