MCF5253CVM140 Freescale Semiconductor, MCF5253CVM140 Datasheet - Page 108

• Manufacturer Part Number: MCF5253CVM140
• Description: IC MPU 32BIT 140MHZ 225-MAPBGA
• Manufacturer: Freescale Semiconductor
• Series: MCF525xr

Specifications of MCF5253CVM140

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 140MHz
• Connectivity: CAN, EBI/EMI, I²C, QSPI, UART/USART, USB OTG
• Peripherals: DMA, WDT
• Program Memory Type: ROMless
• Ram Size: 128K x 8
• Voltage - Supply (vcc/vdd): 1.08 V ~ 1.32 V
• Data Converters: A/D 6x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 225-MAPBGA
• Family Name: MCF5xxx
• Device Core: ColdFire V2
• Device Core Size: 32b
• Frequency (max): 140MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.2/3.3V
• Operating Supply Voltage (max): 1.32/3.6V
• Operating Supply Voltage (min): 1.08/3V
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 225
• Package Type: MA-BGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Number Of I /o: -
• Eeprom Size: -
• Program Memory Size: -
• Lead Free Status / Rohs Status: Compliant

Synchronous DRAM Controller Module
7.3.1
The DRAM controller registers memory map is shown in
7.3.1.1
The DRAM control register (DCR),
7-4
Address MBAR + 0x100
MBAR
Offset
0x10C
0x100
0x104
0x108
0x110
0x114
.
Field
NAM
COC
Reset
SO
15
14
13
12
W
R
Synchronous operation. Selects synchronous or asynchronous mode. When in synchronous mode, the DRAM
controller can be switched to ADRAM mode only by resetting the MCF5253.
0 Asynchronous DRAM. Default at reset. Do not use.
1 Synchronous DRAM
Note: bit setting SO = 0 is a legacy mode. Do not use. First action must always be to set this bit.
Reserved, should be cleared.
No address multiplexing. Some implementations require external multiplexing. For example, when linear addressing
is required, the DRAM should not multiplex addresses on DRAM accesses.
0 The DRAM controller multiplexes the external address bus to provide column addresses.
1 The DRAM controller does not multiplex the external address bus to provide column addresses.
Command on SDRAM clock enable (BCLKE). Implementations that use external multiplexing (NAM = 1) must
support command information to be multiplexed onto the SDRAM address bus.
0 BCLKE functions as a clock enable; self-refresh is initiated by the DRAM controller through DCR[IS].
1 BCLKE drives command information. Because BCLKE is not a clock enable, self-refresh cannot be used (setting
DCR[IS]). Thus, external logic must be used if this functionality is desired. External multiplexing is also responsible
for putting the command information on the proper address bit.
SO
15
0
DRAM control register (DCR)
DRAM address and control register 0 (DACR0) [See
DRAM Controller Registers
Table 7-4. DRAM Control Register (DCR) Field Descriptions (Synchronous Mode)
DRAM mask register block 0 (DMR0) [See
DRAM Control Register (DCR) (Synchronous Mode)
14
–
[31:24]
Figure 7-3. DRAM Control Register (DCR) (Synchronous Mode)
NAM
13
–
COC
12
–
Table 7-3. DRAM Controller Registers
[Section 7.3.1, “DRAM Controller
Figure
IS
11
MCF5253 Reference Manual, Rev. 1
–
10
–
7-3, controls refresh logic.
RTIM
(Synchronous
Section 7.3.1.3, “DRAM Controller Mask Registers
–
9
Description
Reserved
Reserved
Reserved
–
Section 7.3.1.2, “DRAM Address and Control (DACR0)
8
[23:16]
Table
Mode)”]
–
7
Registers”]
7-3.
–
6
5
–
RC
–
4
[15:8]
Freescale Semiconductor
–
3
Access: User read/write
Reserved
2
–
(DMR0)”]
[7:0]
–
1
–
0