MCF51EM256CLL Freescale Semiconductor, MCF51EM256CLL Datasheet - Page 602

IC MCU 32BIT 256KB FLASH 100LQFP

MCF51EM256CLL

Manufacturer Part Number
MCF51EM256CLL
Description
IC MCU 32BIT 256KB FLASH 100LQFP
Manufacturer
Freescale Semiconductor
Series
MCF51EMr
Datasheets

Specifications of MCF51EM256CLL

Core Processor
Coldfire V1
Core Size
32-Bit
Speed
50MHz
Connectivity
I²C, SCI, SPI
Peripherals
LCD, LVD, PWM, WDT
Number Of I /o
63
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 16x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
100-LQFP
Processor Series
MCF51EM
Core
ColdFire V1
Data Bus Width
32 bit
Data Ram Size
16 KB
Interface Type
RS-232, LIN
Maximum Clock Frequency
50 MHz
Number Of Timers
3
Operating Supply Voltage
1.8 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
JLINK-CF-BDM26, EWCF
Development Tools By Supplier
DEMOEM
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

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Manufacturer
Quantity
Price
Part Number:
MCF51EM256CLL
Manufacturer:
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Quantity:
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Part Number:
MCF51EM256CLL
Manufacturer:
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Quantity:
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Version 1 ColdFire Debug (CF1_DEBUG)
26.4.1.5.1
The SYNC command is unlike other BDC commands because the host does not necessarily know the
correct speed to use for serial communications until after it has analyzed the response to the SYNC
command.
To issue a SYNC command, the host:
Upon detecting the sync request from the host (which is a much longer low time than would ever occur
during normal BDC communications), the target:
26-38
1
2
3
SYNC_PC
WRITE_CREG
WRITE_DREG
WRITE_MEM.sz
WRITE_MEM.sz_WS
WRITE_Rn
WRITE_XCSR_BYTE
WRITE_CSR2_BYTE
WRITE_CSR3_BYTE
This column identifies if the command generates an ACK pulse if operating with acknowledge mode enabled. See
Section 26.4.1.5.3, “ACK_ENABLE,”
The SYNC command is a special operation which does not have a command code.
If a GO command is received while the processor is not halted, it performs no operation.
1. Drives the BKGD pin low for at least 128 cycles of the slowest possible BDC clock (bus clock or
2. Drives BKGD high for a brief speed-up pulse to get a fast rise time. (This speedup pulse is typically
3. Removes all drive to the BKGD pin so it reverts to high impedance.
4. Listens to the BKGD pin for the sync response pulse.
1. Waits for BKGD to return to a logic high.
Command
Mnemonic
device-specific alternate clock source).
one cycle of the host clock which is as fast as the maximum target BDC clock.)
SYNC
MCF51EM256 Series ColdFire Integrated Microcontroller Reference Manual, Rev. 8
Classification
Non-Intrusive
Non-Intrusive
Non-Intrusive
Non-Intrusive
Background
Background
Command
Available
Available
Available
Always
Always
Always
Active
Active
Table 26-25. BDM Command Summary (continued)
for addition information.
if Enb?
ACK
Yes
Yes
Yes
Yes
Yes
No
No
No
No
1
(0x11+4 x sz)/ad24/wd.sz/d/ss Write the appropriately-sized (sz) memory
(0x10+4 x sz)/ad24/wd.sz/d
(0xC0+CRN)/wd32/d
(0x80+CRN)/wd32/d
(0x40+CRN)/wd32/d
Command
Structure
0x0D/wd8
0x0E/wd8
0x0F/wd8
0x01/d
Display the CPU’s current PC and capture
it in the PST trace buffer
Write one of the CPU’s control registers
Write one of the debug module’s control
registers
Write the appropriately-sized (sz) memory
value to the location specified by the 24-bit
address
value to the location specified by the 24-bit
address and report status
Write the requested general-purpose
register (An, Dn) of the CPU
Write the most significant byte of the debug
module’s XCSR
Write the most significant byte of the debug
module’s CSR2
Write the most significant byte of the debug
module’s CSR3
Description
Freescale Semiconductor

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