MPC555CME Freescale Semiconductor, MPC555CME Datasheet - Page 881

• Manufacturer Part Number: MPC555CME
• Description: KIT EVALUATION FOR MPC555
• Manufacturer: Freescale Semiconductor
• Type: Microcontrollerr

Specifications of MPC555CME

• Contents: Module Board, Installation Guide, Power Supply, Cable, Software and more
• Processor To Be Evaluated: MPC555
• Data Bus Width: 32 bit
• Interface Type: RS-232
• For Use With/related Products: MPC555
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

G.4.3 Testing Characteristics
G.5 Thermal Characteristics
MPC555 / MPC556
USER’S MANUAL
BGA Package Thermal Resistance,
Junction to Ambient — Natural Convection
BGA Package Thermal Resistance,
Junction to Ambient — Four layer (2s2p) board, natural
convection
BGA Package Thermal Resistance,
Junction to Board
BGA Package Thermal Resistance,
Junction to Case (top)
BGA Package Thermal Resistance,
Junction to Package Top, Natural Convection
NOTES:
1. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting
2. Per SEMI G38-87 and JESD51-2 with the board horizontal.
3. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting
4. Per JESD51-6 with the board horizontal.
5. Thermal resistance between the die and the printed circuit board (Four layer [2s2p] board, natural con-
6. Indicates the thermal resistance between the die and the case top surface as measured by the cold plate
7. Thermal characterization parameter indicating the temperature difference between package top and the
1. Scan range: 150 kHz — 1000 MHz
2. Operating frequency: 20 MHz, 40 MHz
3. Operating voltages: 3.3 V, 5.0 V
4. Max spikes: 50 dBuV
5. I/O port waveforms: 50% duty cycle @ 100 µs period
6. Temperature: 25°C (-40°C, 125°C if available)
site (board) temperature, ambient temperature, air flow, power dissipation of other components on the
board, and the board thermal resistance.
site (board) temperature, ambient temperature, air flow, power dissipation of other components on the
board, and the board thermal resistance.
vection).
method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature.
junction temperature per EIA/JESD51-2.
Characteristic
Table G-2 Thermal Characteristics
ELECTRICAL CHARACTERISTICS
Rev. 15 October 2000
Symbol
R
R
R
R
θ
θMA
θJA
θJB
θJC
JT
42.8
30.4
Value
19.9
6.3
2.7
1,2
3,4
6
7
5
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
MOTOROLA
G-3