MPC555CME Freescale Semiconductor, MPC555CME Datasheet - Page 875

• Manufacturer Part Number: MPC555CME
• Description: KIT EVALUATION FOR MPC555
• Manufacturer: Freescale Semiconductor
• Type: Microcontrollerr

Specifications of MPC555CME

• Contents: Module Board, Installation Guide, Power Supply, Cable, Software and more
• Processor To Be Evaluated: MPC555
• Data Bus Width: 32 bit
• Interface Type: RS-232
• For Use With/related Products: MPC555
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

E.3.4 PLL Off-Chip Capacitor C
E.4 Clock Oscillator and PLL External Components Layout Requirements
E.4.1 Traces and Placement
MPC555 / MPC556
USER’S MANUAL
C
and VDDSYN pads. The maximum noise allowed on XFC is 50 mV peak to peak with
typical cut-off frequency of 500 Hz.
The required value for C
tiplication factor as defined in the PLPRCR register (refer to
Traces connecting capacitors, crystal, resistor should be as short as possible. There-
fore, the components (crystal, resistor and capacitors) should be placed as close to
the oscillator pins of the MPC555 / MPC556 as possible.
XFC
1. 0 < (MF + 1) < 4
2. (MF + 1) ≥ 4
is the PLL feedback capacitor. It must be located as close as possible to the XFC
Keyed
Vcc 3 V
BOARD
BOARD
Figure E-8 PLL Off-Chip Capacitor Example
Figure E-7 LC Filter Example (Alternative)
8.2 mH
FXC
100 nF
CLOCK AND BOARD GUIDELINES
C
XFC
are determined by the following two cases. MF is the mul-
VSSSYN
XFC
C
C
Rev. 15 October 2000
XFC
XFC
= (680 x (MF + 1) – 120) pF
= 1100 x (MF +1) pF
MPC555 / MPC556
VDDSYN
VDDSYN
XFC
MPC555 / MPC556
Table
8-10).
MOTOROLA
E-7