HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 95

• Manufacturer Part Number: HD64F3026X25
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3026X25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

2.9.3
The on-chip supporting modules are accessed in three states. The data bus is 8 or 16 bits wide,
depending on the internal I/O register being accessed. Figure 2.17 shows the on-chip supporting
module access timing. Figure 2.18 indicates the pin states.
Read
access
Write
access
Address bus
AS
D
15
,
On-Chip Supporting Module Access Timing
to D
RD HWR LWR
Figure 2.18 Pin States during Access to On-Chip Supporting Modules
Address bus
Internal read signal
Internal data bus
Internal write signal
Internal data bus
,
0
Figure 2.17 Access Cycle for On-Chip Supporting Modules
,
High
T
1
T state
1
High impedance
Address
Rev. 2.00 Sep 20, 2005 page 55 of 800
T
Bus cycle
2
Address
T state
2
Read data
Write data
T
3
T state
3
REJ09B0260-0200
Section 2 CPU