HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 619

• Manufacturer Part Number: HD64F3026X25
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3026X25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

18.12
Please note the following when converting the F-ZTAT application software to the mask ROM
versions.
The values read from the internal registers for the flash ROM or the mask ROM version and
F-ZTAT version differ as follows.
Note: This difference applies to all the F-ZTAT versions and all the mask ROM versions that have
Register
FLMCR1
different ROM size.
Notes when Converting the F-ZTAT Application Software to the
Mask ROM Versions
Bit
FWE
Value
0
1
F-ZTAT Version
Application software running
Programming
Section 18 Flash Memory [H8/3024F-ZTAT Version]
Rev. 2.00 Sep 20, 2005 page 579 of 800
Status
Mask ROM Version
— (Is not read out)
Application software running
(Always read as 1)
REJ09B0260-0200