HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 94

• Manufacturer Part Number: HD64F3026X25
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3026X25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Section 2 CPU
2.9.2
On-chip memory is accessed in two states. The data bus is 16 bits wide, permitting both byte and
word access. Figure 2.15 shows the on-chip memory access cycle. Figure 2.16 indicates the pin
states. All H8/3024 Group models have a function for changing the method of outputting
addresses from the address pins. For details see section 6.3.5, Address Output Method.
Rev. 2.00 Sep 20, 2005 page 54 of 800
REJ09B0260-0200
Figure 2.16 Pin States during On-Chip Memory Access (Address Update Mode 1)
On-Chip Memory Access Timing
Internal address bus
Internal read signal
Internal data bus
(read access)
Internal write signal
Internal data bus
(write access)
Address bus
AS
D
15
,
to D
RD HWR LWR
,
0
Figure 2.15 On-Chip Memory Access Cycle
,
High
T state
1
T
1
High impedance
Bus cycle
Address
Address
Read data
Write data
T state
2
T
2