HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 674

• Manufacturer Part Number: HD64F3026X25
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3026X25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Section 21 Electrical Characteristics
Rev. 2.00 Sep 20, 2005 page 634 of 800
REJ09B0260-0200
A
CS
RD
(read)
D
(read)
HWR, LWR
(write)
D
(write)
Note:
AS
23
15
15
n
to A
to D
to D
*
0
0
0
,
Specification from the earliest negation timing of A
t
AD
t
CH
Figure 21.11 Basic Bus Cycle: Two-State Access
t
t
t
AS1
AS1
AS1
t
T
cyc
1
t
t
t
t
WDD
ASD
ASD
ASD
t
ACC1
t
Cf
t
CL
t
cyc
t
t
ACC3
ACC3
t
t
WSW1
WDS1
t
Cr
23
to A
T
0
2
, CS
t
t
SD
SD
t
RDS
n
, and RD.
t
AH
t
t
AH
WDH
t
RSD
t
RDH
t
t
PCH1
PCH1
*
t
PCH2