HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 587

• Manufacturer Part Number: HD64F3026X25
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3026X25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

18.5
When pins are set to on-board programming mode and a reset-start is executed, the chip enters the
on-board programming state in which on-chip flash memory programming, erasing, and verifying
can be carried out. There are two operating modes in this mode—boot mode and user program
mode. The pin settings for entering each mode are shown in table 18.6. For a diagram of the
transitions to the various flash memory modes, see figure 18.3.
Boot mode and user program mode cannot be used in the H8/3024F-ZTAT version’s mode 6 (on-
chip ROM enabled).
Table 18.6 On-Board Programming Mode Settings
Mode
Boot mode
User program mode
Notes: 1. For the High level input timing, see items 6 and 7 of Notes on Use of Boot Mode.
2. In boot mode, the MD
On-Board Programming Mode
In the boot mode in the H8/3024F-ZTAT version, the levels of the mode pins (MD
MD
register (MDCR).
0
) are reflected in mode select bits 2 to 0 (MDS2 to MDS0) in the mode control
Mode 5
Mode 5
Mode 7
Mode 7
2
setting should be the inverse of the input.
FWE
1 *
1
Section 18 Flash Memory [H8/3024F-ZTAT Version]
MD
0 *
0 *
1
1
2
2
Rev. 2.00 Sep 20, 2005 page 547 of 800
2
MD
0
1
0
1
1
REJ09B0260-0200
MD
1
1
1
1
0
2
to