HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 667

MCU 3V 256K 100-TQFP

HD64F3026X25

Manufacturer Part Number
HD64F3026X25
Description
MCU 3V 256K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3026X25

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
70
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F3026X25
Manufacturer:
Renesas Electronics America
Quantity:
10 000
21.2.4
Table 21.17 lists the A/D conversion characteristics.
Table 21.17 A/D Conversion Characteristics
Conditions: V
Item
Conversion time:
134 states
Conversion time:
70 states
A/D Conversion Characteristics
fmax = 25 MHz, T
T
a
CC
= –40°C to +85°C (wide-range specifications)
= 3.0 to 3.6 V, AV
Resolution
Conversion time (single mode)
Analog input capacitance
Permissible signal-
source impedance
Nonlinearity error
Offset error
Full-scale error
Quantization error
Absolute accuracy
Resolution
Conversion time (single mode)
Analog input capacitance
Permissible signal-
source impedance
Nonlinearity error
Offset error
Full-scale error
Quantization error
Absolute accuracy
a
= –20°C to +75°C (regular specifications),
CC
= 3.0 to 3.6 V, V
> 13 MHz
> 13 MHz
13 MHz
13 MHz
REF
Rev. 2.00 Sep 20, 2005 page 627 of 800
= 3.0 to AV
Section 21 Electrical Characteristics
Min
10
5.36
10
5.36
CC
, V
Typ
10
10
SS
= AV
REJ09B0260-0200
Max
10
20
10
5
±3.5
±3.5
±3.5
±0.5
±4.0
10
20
5
3
±7.5
±7.5
±7.5
±0.5
±4.0
SS
= 0 V,
Unit
bits
pF
k
k
LSB
LSB
LSB
LSB
LSB
bits
pF
k
k
LSB
LSB
LSB
LSB
LSB
s
s

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