HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 704

MCU 3V 256K 100-TQFP

HD64F3026X25

Manufacturer Part Number
HD64F3026X25
Description
MCU 3V 256K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3026X25

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
70
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F3026X25
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Appendix A Instruction Set
Rev. 2.00 Sep 20, 2005 page 664 of 800
REJ09B0260-0200
Instruction Mnemonic
MOV
MOVFPE
MOVTPE
MULXS
MULXU
NEG
NOP
NOT
OR
ORC
POP
PUSH
ROTL
ROTR
MOV.L ERs, @–ERd
MOV.L ERs, @aa:16
MOV.L ERs, @aa:24
MOVFPE @aa:16,
Rd *
MOVTPE Rs,
@aa:16 *
MULXS.B Rs, Rd
MULXS.W Rs, ERd
MULXU.B Rs, Rd
MULXU.W Rs, ERd
NEG.B Rd
NEG.W Rd
NEG.L ERd
NOP
NOT.B Rd
NOT.W Rd
NOT.L ERd
OR.B #xx:8, Rd
OR.B Rs, Rd
OR.W #xx:16, Rd
OR.W Rs, Rd
OR.L #xx:32, ERd
OR.L ERs, ERd
ORC #xx:8, CCR
POP.W Rn
POP.L ERn
PUSH.W Rn
PUSH.L ERn
ROTL.B Rd
ROTL.W Rd
ROTL.L ERd
ROTR.B Rd
ROTR.W Rd
ROTR.L ERd
2
2
Instruction
Fetch
I
2
3
4
2
2
2
2
1
1
1
1
1
1
1
1
1
1
1
2
1
3
2
1
1
2
1
2
1
1
1
1
1
1
Branch
Addr. Read
J
Stack
Operation
K
Byte Data
Access
L
1
1
Word Data
Access
M
2
2
2
1
2
1
2
Internal
Operation
N
2
12
20
12
20
2
2
2
2

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