HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 778

• Manufacturer Part Number: HD64F3026X25
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3026X25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Appendix B Internal I/O Registers
NDERB—Next Data Enable Register B
NDERA—Next Data Enable Register A
Rev. 2.00 Sep 20, 2005 page 738 of 800
REJ09B0260-0200
Initial value
Read/Write
Initial value
Read/Write
Bit
Bit
NDER15
NDER7
R/W
R/W
7
0
7
0
NDER14
NDER6
R/W
R/W
Bits 7 to 0
Bits 7 to 0
NDER15
to NDER8
NDER7
to NDER0
6
0
6
0
0
1
0
1
NDER13
NDER5
R/W
R/W
5
0
5
0
TPC outputs TP
(NDR15 to NDR8 are not transferred to PB
TPC outputs TP
(NDR15 to NDR8 are transferred to PB
TPC outputs TP
(NDR7 to NDR0 are not transferred to PA
TPC outputs TP
(NDR7 to NDR0 are transferred to PA
Next data enable 15 to 8
Next data enable 7 to 0
NDER12
NDER4
R/W
R/W
4
0
4
0
H'FFFA2
H'FFFA3
15
15
7
7
to TP
to TP
to TP
to TP
NDER11
NDER3
Description
Description
R/W
R/W
3
0
3
0
0
0
8
8
are disabled
are enabled
are disabled
are enabled
NDER10
NDER2
R/W
R/W
2
0
2
0
7
7
to PA
to PB
7
7
to PA
to PB
0
NDER9
NDER1
)
0
R/W
R/W
)
1
0
1
0
0
)
0
)
NDER8
NDER0
R/W
R/W
0
0
0
0
TPC
TPC