HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 167

• Manufacturer Part Number: HD64F3026X25
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3026X25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Section 6 Bus Controller
6.3.2
Bus Specifications
The external space bus specifications consist of three elements: bus width, number of access
states, and number of program wait states.
The bus width and number of access states for on-chip memory and registers are fixed, and are not
affected by the bus controller.
Bus Width: A bus width of 8 or 16 bits can be selected with ABWCR. An area for which an 8-bit
bus is selected functions as an 8-bit access space, and an area for which a 16-bit bus is selected
functions as a16-bit access space.
If all areas are designated for 8-bit access, 8-bit bus mode is set; if any area is designated for 16-
bit access, 16-bit bus mode is set.
Number of Access States: Two or three access states can be selected with ASTCR. An area for
which two-state access is selected functions as a two-state access space, and an area for which
three-state access is selected functions as a three-state access space.
When two-state access space is designated, wait insertion is disabled.
Number of Program Wait States: When three-state access space is designated in ASTCR, the
number of program wait states to be inserted automatically is selected with WCRH and WCRL.
From 0 to 3 program wait states can be selected.
Table 6.3 shows the bus specifications for each basic bus interface area.
Rev. 2.00 Sep 20, 2005 page 127 of 800
REJ09B0260-0200