HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 188

• Manufacturer Part Number: HD64F3026X25
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3026X25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Section 6 Bus Controller
When making a transition to software standby mode, if there is contention with a bus request from
an external bus master, the
When using software standby mode, clear the BRLE bit to 0 in BRCR before executing the
SLEEP instruction.
Rev. 2.00 Sep 20, 2005 page 148 of 800
REJ09B0260-0200
Address bus
HWR, LWR
Data bus
BREQ
BACK
RD
AS
Figure 6.20 Example of External Bus Master Operation
B A C K
T
High
0
(1)
and strobe states may be indefinite when the transition is made.
CPU cycles
Minimum 3 cycles
T
Address
1
T
2
(2)
(3)
External bus released
High-impedance
High-impedance
High-impedance
High-impedance
High-impedance
(4)
(5)
(6)
CPU cycles