HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 112

MCU 3V 256K 100-TQFP

HD64F3026X25

Manufacturer Part Number
HD64F3026X25
Description
MCU 3V 256K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3026X25

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
70
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F3026X25
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 4 Exception Handling
4.1.3
The exception sources are classified as shown in figure 4.1. Different vectors are assigned to
different exception sources. Table 4.2 lists the exception sources and their vector addresses.
Rev. 2.00 Sep 20, 2005 page 72 of 800
REJ09B0260-0200
Exception
sources
Exception Vector Table
• Reset
• Interrupts
• Trap instruction
Figure 4.1 Exception Sources
External interrupts:
Internal interrupts:
NMI, IRQ to IRQ
27 interrupts from on-chip
supporting modules
0
5

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