HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 25

• Manufacturer Part Number: HD64F3026X25
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3026X25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Section 1 Overview
Figure 1.1
Figure 1.2
Figure 1.3
Section 2 CPU
Figure 2.1
Figure 2.2
Figure 2.3
Figure 2.4
Figure 2.5
Figure 2.6
Figure 2.7
Figure 2.8
Figure 2.9
Figure 2.10
Figure 2.11
Figure 2.12
Figure 2.13
Figure 2.14
Figure 2.15
Figure 2.16
Figure 2.17
Figure 2.18
Section 3 MCU Operating Modes
Figure 3.1
Figure 3.2
Section 4 Exception Handling
Figure 4.1
Figure 4.2
Block Diagram.....................................................................................................
Pin Arrangement of H8/3024F-ZTAT, H8/3026F-ZTAT,
H8/3024 Mask ROM Version, and H8/3026 Mask ROM Version
(FP-100B or TFP-100B Package, Top View)......................................................
Pin Arrangement of H8/3024F-ZTAT, H8/3026F-ZTAT,
H8/3024 Mask ROM Version, and H8/3026 Mask ROM Version
(FP-100A Package, Top View)............................................................................
CPU Operating Modes......................................................................................... 20
Memory Map ....................................................................................................... 21
CPU Registers...................................................................................................... 22
Usage of General Registers.................................................................................. 23
Stack .................................................................................................................... 24
General Register Data Formats............................................................................ 26
General Register Data Formats............................................................................ 27
Memory Data Formats......................................................................................... 28
Instruction Formats.............................................................................................. 41
Memory-Indirect Branch Address Specification ................................................. 45
Processing States ................................................................................................. 49
Classification of Exception Sources .................................................................... 50
State Transitions .................................................................................................. 51
Stack Structure after Exception Handling............................................................ 52
On-Chip Memory Access Cycle .......................................................................... 54
Pin States during On-Chip Memory Access (Address Update Mode 1).............. 54
Access Cycle for On-Chip Supporting Modules.................................................. 55
Pin States during Access to On-Chip Supporting Modules ................................. 55
Memory Map of H8/3024F-ZTAT and H8/3024 Mask ROM Version in Each
Operating Mode................................................................................................... 66
Memory Map of H8/3026F-ZTAT and H8/3026 Mask ROM Version in Each
Operating Mode................................................................................................... 68
Exception Sources ............................................................................................... 72
Reset Sequence (Modes 1 and 3)......................................................................... 75
Figures
Rev. 2.00 Sep 20, 2005 page xxiii of xxxviii
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