HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 651

MCU 3V 256K 100-TQFP

HD64F3026X25

Manufacturer Part Number
HD64F3026X25
Description
MCU 3V 256K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3026X25

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
70
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F3026X25
Manufacturer:
Renesas Electronics America
Quantity:
10 000
21.1.3
Clock timing parameters are listed in table 21.4, control signal timing parameters in table 21.5,
and bus timing parameters in table 21.6. Timing parameters of the on-chip supporting modules are
listed in table 21.7.
AC Characteristics
H8/3024 mask ROM version
H8/3026 mask ROM version
Figure 21.1 Darlington Pair Drive Circuit (Example)
H8/3024 mask ROM version
H8/3026 mask ROM version
Figure 21.2 Sample LED Circuit
Port
Ports 1, 2, 5
2 k
Rev. 2.00 Sep 20, 2005 page 611 of 800
LED
Section 21 Electrical Characteristics
Darlington pair
600
REJ09B0260-0200

Related parts for HD64F3026X25