HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 68

MCU 3V 256K 100-TQFP

HD64F3026X25

Manufacturer Part Number
HD64F3026X25
Description
MCU 3V 256K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3026X25

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
70
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F3026X25
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 2 CPU
When ER7 (SP) is used as an address register to access the stack, the operand size should be word
size or longword size.
Rev. 2.00 Sep 20, 2005 page 28 of 800
REJ09B0260-0200
Data Type
1-bit data
Byte data
Word data
Longword data
Figure 2.8 Memory Data Formats
Address
Address L
Address L
Address 2M
Address 2M + 1
Address 2N
Address 2N + 1
Address 2N + 2
Address 2N + 3
MSB
MSB
MSB
7
7
6
Data Format
5
4
3
2
1
LSB
LSB
LSB
0
0

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