HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 46

• Manufacturer Part Number: HD64F3026X25
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3026X25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Section 1 Overview
1.2
Figure 1.1 shows an internal block diagram.
Rev. 2.00 Sep 20, 2005 page 6 of 800
REJ09B0260-0200
Note: * Functions as RESO in the mask ROM versions, and as FWE in the on-chip flash memory versions.
ADTRG/CS
CS
CS
Block Diagram
1
2
RESO/FWE *
3
/IRQ
/IRQ
BREQ/P6
BACK/P6
/IRQ
WAIT/P6
HWR/P6
LWR/P6
CS
IRQ
RD/P6
AS/P6
0
3
2
EXTAL
1
/P8
/P8
/P8
0
/P8
STBY
XTAL
/P8
MD
MD
MD
RES
/P6
NMI
4
3
2
1
6
5
2
1
0
4
3
0
7
2
1
0
Port B
Figure 1.1 Block Diagram
Interrupt controller
controller (TPC)
(mask ROM or
16-bit timer unit
flash memory)
Programmable
8-bit timer unit
timing pattern
ROM
RAM
Port A
H8/300H CPU
Port 3
Serial communication
(SCI)
Watchdog timer
A/D converter
D/A converter
Address bus
Data bus (upper)
Data bus (lower)
interface
(WDT)
2 channels
Port 4
Port 7
P5 /A
P5 /A
P5 /A
P5 /A
P2 /A
P2 /A
P2 /A
P2 /A
P2 /A
P2 /A
P2 /A
P2 /A
P1 /A
P1 /A
P1 /A
P1 /A
P1 /A
P1 /A
P1 /A
P1 /A
P9 /SCK /IRQ
P9 /SCK /IRQ
P9 /RxD
P9 /RxD
P9 /TxD
P9 /TxD
3
2
1
0
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
5
4
3
2
1
0
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
1
0
1
0
1
0
5
4