HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 567

• Manufacturer Part Number: HD64F3026X25
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3026X25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

17.13
When ordering H8/3026 with mask ROM, note the following.
1. When ordering by means of an EPROM, use a 512-kbyte one.
2. Fill all unused addresses with H'FF as shown in figure 17.20 to make the ROM data size 512-
3. The flash memory control registers (FLMCR, EBR, RAMCR, FLMSR, FLMCR1, FLMCR2,
Note: * Write H'FF in all addresses in these areas.
kbytes for the H8/3026 mask ROM version. This applies to ordering by means of an EPROM
and by means of data transmission.
EBR1, and EBR2) used by the version with on-chip flash memory are not provided in the
mask ROM version. Reading the corresponding addresses in a mask ROM version will always
return 1s, and writes to these addresses are disabled. This must be borne in mind when
switching from a flash memory version to a mask ROM version.
Notes on Ordering Mask ROM Version Chip
Figure 17.20 Mask ROM Addresses and Data
(ROM: 256 kbytes)
H'00000–7FFFF
HD6433026
Addresses:
Not used *
Section 17 Flash Memory [H8/3026F-ZTAT Version]
Rev. 2.00 Sep 20, 2005 page 527 of 800
H'00000
H'3FFFF
H'40000
H'7FFFF
REJ09B0260-0200