HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 117

MCU 3V 256K 100-TQFP

HD64F3026X25

Manufacturer Part Number
HD64F3026X25
Description
MCU 3V 256K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3026X25

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
70
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F3026X25
Manufacturer:
Renesas Electronics America
Quantity:
10 000
4.2.3
If an interrupt is accepted after a reset but before the stack pointer (SP) is initialized, PC and CCR
will not be saved correctly, leading to a program crash. To prevent this, all interrupt requests,
including NMI, are disabled immediately after a reset exception handling. The first instruction of
the program is always executed immediately after the reset state ends. This instruction should
initialize the stack pointer (example: MOV.L #xx:32, SP).
4.3
Interrupt exception handling can be requested by seven external sources (NMI, IRQ
27 internal sources in the on-chip supporting modules. Figure 4.5 classifies the interrupt sources
and indicates the number of interrupts of each type.
RES
Internal
address bus
Internal
read signal
Internal
write signal
Internal
data bus
(16 bits wide)
Interrupts after Reset
Interrupts
(1) Address of reset exception handling vector (H'0000)
(2) Start address (contents of reset exception handling vector address)
(3) First instruction of program
Figure 4.4 Reset Sequence (Mode 6)
Vector fetch
(2)
(1)
Internal
processing
Rev. 2.00 Sep 20, 2005 page 77 of 800
Prefetch of
first program
instruction
Section 4 Exception Handling
(3)
(2)
REJ09B0260-0200
0
to IRQ
5
), and

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