HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 47

• Manufacturer Part Number: HD64F3026X25
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3026X25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

1.3
1.3.1
The pin arrangement of the H8/3024 Group is shown in figures 1.2 to 1.5. Differences in the
H8/3024 Group pin arrangements are shown in table 1.2. Except for the differences shown in table
1.2, the pin arrangements are the same.
Table 1.2
Package
FP-100B
(TFP-100B)
FP-100A
Pin Description
Pin Arrangement
Comparison of H8/3024 Group Pin Arrangements
Pin
Number
10
12
H8/3024F-ZTAT
FWE
FWE
H8/3026F-ZTAT
FWE
FWE
Rev. 2.00 Sep 20, 2005 page 7 of 800
H8/3024 Mask
ROM Version
R E S O
R E S O
Section 1 Overview
REJ09B0260-0200
H8/3026 Mask
ROM Version
R E S O
R E S O