HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 707

• Manufacturer Part Number: HD64F3026X25
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3026X25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Table B.1
Notes: 1. A dash (“—”) indicates that an access will always return 1s, and writes are invalid.
Address
(Low)
H'EE01E
H'EE030
H'EE031
H'EE032
H'EE033
H'EE077
H'EE07D
2. Shading indicates that access is prohibited. Normal operation is not guaranteed if these
addresses are accessed.
Comparison of H8/3024 Group Internal I/O Register Specifications
H8/3024 Mask ROM,
H8/3026 Mask ROM
ADRCR
—
—
—
—
—
—
Appendix B Internal I/O Registers
H8/3026F-ZTAT
Version
FLMCR1
EBR1
EBR2
RAMCR
ADRCR
FLMCR2
Rev. 2.00 Sep 20, 2005 page 667 of 800
H8/3024F-ZTAT
ADRCR
FLMCR1
FLMCR2
EBR
RAMCR
Version
Appendix B Internal I/O Registers
REJ09B0260-0200
Module
Bus controller
Flash memory