HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 328

MCU 3V 256K 100-TQFP

HD64F3026X25

Manufacturer Part Number
HD64F3026X25
Description
MCU 3V 256K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3026X25

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
70
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F3026X25
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 9 8-Bit Timers
Rev. 2.00 Sep 20, 2005 page 288 of 800
REJ09B0260-0200
C
U
C
U
C
U
C
U
P
P
P
P
Internal data bus
Internal data bus
Internal data bus
Internal data bus
Figure 9.5 8TCNT1 Access Operation (CPU Writes to 8TCNT1, Lower Byte)
Figure 9.4 8TCNT0 Access Operation (CPU Writes to 8TCNT0, Upper Byte)
Figure 9.6 8TCNT0 Access Operation (CPU Reads 8TCNT0, Upper Byte)
Figure 9.7 8TCNT1 Access Operation (CPU Reads 8TCNT1, Lower Byte)
H
H
H
H
L
L
L
L
Bus
interface
Bus
interface
Bus
interface
Bus
interface
8TCNTH0 8TCNTL1
8TCNTH0 8TCNTL1
8TCNT0 8TCNT1
8TCNT0 8TCNT1
H
H
H
H
L
L
L
L
Module data bus
Module data bus
Module data bus
Module data bus

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