HD64F3026X25 Renesas Electronics America, HD64F3026X25 Datasheet - Page 633

• Manufacturer Part Number: HD64F3026X25
• Description: MCU 3V 256K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3026X25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

20.2
The H8/3024 Group has a system control register (SYSCR) that controls the power-down state,
and module standby control registers H (MSTCRH) and L (MSTCRL) that control the module
standby function. Table 20.2 summarizes these registers.
Table 20.2 Control Register
Note: * Lower 20 bits of the address in advanced mode.
20.2.1
SYSCR is an 8-bit readable/writable register. Bit 7 (SSBY), bits 6 to 4 (STS2 to STS0), and bit 1
(SSOE) control the power-down state. For information on the other SYSCR bits, see section 3.3,
System Control Register (SYSCR).
Address *
H'EE012
H'EE01C
H'EE01D
Bit
Initial value
Read/Write
Register Configuration
System Control Register (SYSCR)
Name
Module standby control register H
Module standby control register L
System control register
SSBY
Software standby
Enables transition to
software standby mode
R/W
7
0
STS2
R/W
6
0
STS1
Standby timer select 2 to 0
These bits select the
waiting time of the CPU
and peripheral functions
R/W
5
0
STS0
R/W
4
0
Abbreviation
SYSCR
MSTCRH
MSTCRL
Rev. 2.00 Sep 20, 2005 page 593 of 800
User bit enable
R/W
UE
3
1
NMIEG
Section 20 Power-Down State
NMI edge select
R/W
2
0
R/W
R/W
R/W
R/W
SSOE
Software standby
output port enable
R/W
REJ09B0260-0200
1
0
Initial Value
H'09
H'78
H'00
RAM enable
RAME
R/W
0
1